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ADP2106ACPZ-1.5-R7 Datasheet(PDF) 5 Page - Analog Devices |
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ADP2106ACPZ-1.5-R7 Datasheet(HTML) 5 Page - Analog Devices |
5 / 32 page ADP2105/ADP2106/ADP2107 Rev. 0 | Page 5 of 32 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating IN, EN, SS, COMP, OUT_SENSE/FB to AGND −0.3 V to +6 V LX1, LX2 to PGND −0.3 V to (VIN + 0.3 V) PWIN1, PWIN2 to PGND −0.3 V to +6 V PGND to AGND −0.3 V to +0.3 V GND to AGND −0.3 V to +0.3 V PWIN1, PWIN2 to IN −0.3 V to +0.3 V Operating Junction Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 3. Thermal Resistance Package Type θJA1 Unit 16-Lead LFCSP_VQ/QFN 40 °C/W Maximum Power Dissipation 1 W 1 θJA is specified for the worst-case conditions; that is, θJA is specified for device soldered in circuit board for surface mount packages. BOUNDARY CONDITION Natural convection, 4-layer board, exposed pad soldered to the PCB. ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. |
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