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| NCN4557 |
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 ONSEMI
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5 page 
NCN4557 http://onsemi.com 5 ATTRIBUTES Characteristics Values ESD protection Human Body Model (HBM): Card Pins (1, 4, 5, 6, 7, 14, 15 , 16 & 17) (Note 1) All Other Pins (Note 1) Machine Model (MM): Card Pins (1, 4, 5, 6, 7, 14, 15 , 16 & 17) All Other Pins Charged Device Model (CDM): Card Pins (1, 4, 5, 6, 7, 14, 15 , 16 & 17) All Other Pins 8 kV 2 kV 600 V 200 V 2 kV 400 V Moisture sensitivity (Note 2) QFN−16 Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. Human Body Model (HBM): R =1500 W, C = 100 pF. 2. For additional information, see Application Note AND8003/D. MAXIMUM RATINGS Rating Symbol Value Unit LDO Power Supply Voltage VBAT −0.5 ≤ VBAT ≤ 6 V Power Supply Microcontroller Side VDD −0.5 ≤ VDD ≤ 6 V External Card Power Supply CRD_VCC −0.5 ≤ CRD_VCC ≤ 6 V Digital Input Pins Vin Iin −0.5 ≤ Vin ≤ VDD + 0.5 but < 6.0 ±5 V mA Digital Output Pins Vout Iout −0.5 ≤ Vout ≤ VDD + 0.5 but < 6.0 ± 10 V mA CRD Output Pins CRD_I/O & CRD_RST Pins CRD_CLK Pin Vout Iout −0.5 ≤ Vout ≤ CRD_VCC + 0.5 but < 6.0 15 (Internally Limited) 70 (Internally Limited) V mA QFN−16 Low Profile package Power Dissipation @ TA = +85°C Thermal Resistance Junction−to−Air PD RqJA 450 90 mW °C/W Operating Ambient Temperature Range TA −40 to +85 °C Operating Junction Temperature Range TJ −40 to +125 °C Maximum Junction Temperature TJmax +125 °C Storage Temperature Range Tstg −65 to + 150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. |
