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MC100E210 Datasheet(PDF) 6 Page - ON Semiconductor

Part No. MC100E210
Description  5V ECL Dual 1:4, 1:5 Differential Fanout Buffer
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Maker  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
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 6 page
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MC100E210
http://onsemi.com
6
PACKAGE DIMENSIONS
PLCC−28
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776−02
ISSUE E
0.007 (0.180)
TL −M S N S
M
0.007 (0.180)
TL −M S N S
M
0.007 (0.180)
TL −M S N S
M
0.010 (0.250)
TL −M S N S
S
0.007 (0.180)
TL −M S N S
M
0.010 (0.250)
TL −M S N S
S
0.007 (0.180)
TL −M S N S
M
0.007 (0.180)
TL −M S N S
M
0.004 (0.100)
SEATING
PLANE
-T-
12.32
12.32
4.20
2.29
0.33
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
10.42
1.02
12.57
12.57
4.57
2.79
0.48
0.81
11.58
11.58
1.21
1.21
1.42
0.50
10°
10.92
1.27 BSC
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
MIN
MIN
MAX
MAX
INCHES
MILLIMETERS
DIM
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
VIEW S
B
U
Z
G1
X
VIEW D-D
H
K
F
VIEW S
G
C
Z
A
R
E
J
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
0.410
0.040
0.495
0.495
0.180
0.110
0.019
0.032
0.456
0.456
0.048
0.048
0.056
0.020
10°
0.430
0.050 BSC
-N-
Y BRK
D
D
W
-M-
-L-
28
1
V
G1
K1




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