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Sep 03, 2004 V.2
Product specification
Chip Resistor Surface Mount
7
10
SERIES
RC
0402 (Pb Free)
TESTS AND REQUIREMENTS
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
At +25/–55 °C and +25/+125 °C
Temperature
Coefficient of
Resistance
(T.C.R.)
MIL-STD-202F-method 304;
JIS C 5202-4.8
Formula:
T.C.R= ------------------------- ×106 (ppm/°C)
Where
t1=+25 °C or specified room temperature
t2=–55 °C or +125 °C test temperature
R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
Refer to table 2
Thermal Shock
MIL-STD-202F-method 107G;
IEC 60115-1 4.19
At –65 (+0/–10) °C for 2 minutes and at +155
(+10/–0) °C for 2 minutes; 25 cycles
±(0.5%+0.05 Ω) for 1% tol.
±(1.0%+0.05 Ω) for 5% tol.
Low
Temperature
Operation
MIL-R-55342D-Para 4.7.4
At –65 (+0/–5) °C for 1 hour; RCWV applied
for 45 (+5/–0) minutes
±(0.5%+0.05 Ω) for 1% tol .
±(1.0%+0.05 Ω) for 5% tol.
No visible damage
Short Time
Overload
MIL-R-55342D-Para 4.7.5;
IEC 60115-1 4.13
2.5 × RCWV applied for 5 seconds at room
temperature
±(1.0%+0.05 Ω) for 1% tol.
±(2.0%+0.05 Ω) for 5% tol.
No visible damage
Insulation
Resistance
MIL-STD-202F-method 302;
IEC 60115-1 4.6.1.1
RCOV for 1 minute
Type
RC0402
Voltage (DC)
100 V
≥10 GΩ
Dielectric
Withstand
Voltage
MIL-STD-202F-method 301;
IEC 60115-1 4.6.1.1
Maximum voltage (Vrms) applied for 1 minute
Type
RC0402
Voltage (AC)
100 Vrms
No breakdown or flashover
Resistance to
Soldering
Heat
MIL-STD-202F-method 210C;
IEC 60115-1 4.18
Unmounted chips; 260 ±5 °C for 10 ±1
seconds
±(0.5%+0.05 Ω) for 1% tol.
±(1.0%+0.05 Ω) for 5% tol.
No visible damage
Life
MIL-STD-202F-method 108A;
IEC 60115-1 4.25.1
At 70±2 °C for 1,000 hours; RCWV applied for
1.5 hours on and 0.5 hour off
±(1%+0.05 Ω) for 1% tol.
±(3%+0.05 Ω) for 5% tol.
R2–R1
R1(t2–t1)
Table 4 Test condition, procedure and requirements
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