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Phycomp
Product specification
Surface-mount ceramic
multilayer antennas
2.45 GHz ISM-band antenna for
Bluetooth and WLAN IEEE 802.11b
2002 Oct 17 Rev.2
8
www.yageo.com
TESTS AND REQUIREMENTS
Table 3
Test procedures and requirements
IEC
60384-10/
CECC 32 100
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
4.4
mounting
the antenna may be
mounted on printed-circuit
boards or ceramic
substrates by applying
wave soldering, reflow
soldering (including vapour
phase soldering) or
conductive adhesive
no visible damage
4.5
visual inspection and
dimension check
any applicable method
using
×10 magnification
no cracks or fissures larger
than 4 mm
4.6.1
antenna
frequency:
2.45 GHz @ 20
°C
standard test board from Fig.3
4.8
adhesion
a force of 5 N applied for
10 s to the line joining the
terminations and in a plane
parallel to the substrate
no visible damage
mounted in accordance
with CECC 32 100,
paragraph 4.4
no visible damage
4.9
bond strength of
plating on end face
conditions: bending 1 mm
at a rate of 1 mm/s; radius
jig: 340 mm; 2 mm warp on
FR4 board of 90 mm length
no visible damage
resistance to
soldering heat
260
±5 °C for 10 ±0.5 s
in a static solder bath
the terminations shall be well
tinned after recovery;
centre frequency shift
within
±6%
4.10
20 (Tb)
resistance to
leaching
260
±5 °C for 30 ±1 s
in a static solder bath
using visual enlargement of
×10, dissolution of the
terminations shall not
exceed 10%
4.11
20 (Ta)
solderability
zero hour test, and test
after storage
(20 to 24 months) in
original packing in normal
atmosphere;
unmounted chips
completely immersed for
2
±0.5 s in a solder bath
at 235
±5 °C
the terminations must be
well tinned for at least 75%
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