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HLX6256-SH Datasheet(PDF) 3 Page - Honeywell Solid State Electronics Center |
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HLX6256-SH Datasheet(HTML) 3 Page - Honeywell Solid State Electronics Center |
3 / 12 page 3 HLX6256 Total Dose ≥1x106 rad(SiO 2) Transient Dose Rate Upset (3) ≥1x109 rad(Si)/s Transient Dose Rate Survivability (3) ≥1x1011 rad(Si)/s Soft Error Rate (SER) <1x10-10 upsets/bit-day Neutron Fluence ≥1x1014 N/cm2 Parameter Limits (2) Test Conditions RADIATION HARDNESS RATINGS (1) Units TA=25 °C Total Ionizing Radiation Dose The SRAM will meet all stated functional and electrical specifications over the entire operating temperature range after the specified total ionizing radiation dose. All electrical and timing performance parameters will remain within specifications after rebound at VDD = 3.6 V and T =125 °C extrapolated to ten years of operation. Total dose hardness is assured by wafer level testing of process monitor transis- tors and RAM product using 10 keV X-ray and Co60 radiation sources. Transistor gate threshold shift correla- tions have been made between 10 keV X-rays applied at a dose rate of 1x105 rad(SiO 2)/min at T = 25°C and gamma rays (Cobalt 60 source) to ensure that wafer level X-ray testing is consistent with standard military radiation test environments. Transient Pulse Ionizing Radiation The SRAM is capable of writing, reading, and retaining stored data during and after exposure to a transient ionizing radiation pulse up to the transient dose rate upset specification, when applied under recommended operat- ing conditions. To ensure validity of all specified perfor- mance parameters before, during, and after radiation (timing degradation during transient pulse radiation (tim- ing degradation during transient pulse radiation is ≤10%), it is suggested that stiffening capacitance be placed on or near the package VDD and VSS, with a maximum induc- tance between the package (chip) and stiffening capaci- tance of 0.7 nH per part. If there are no operate-through or valid stored data requirements, typical circuit board mounted de-coupling capacitors are recommended. (1) Device will not latch up due to any of the specified radiation exposure conditions. (2) Operating conditions (unless otherwise specified): VDD=3.0 V to 3.6 V, TA=-55 °C to 125°C. (3) Not guaranteed with 28–Lead DIP. 1 MeV equivalent energy, Unbiased, TA=25 °C TA=125 °C, Adams 10% worst case environment Pulse width ≤50 ns, X-ray, VDD=4.0 V, TA=25 °C Pulse width ≤1 µs The SRAM will meet any functional or electrical specifica- tion after exposure to a radiation pulse of up to the transient dose rate survivability specification, when applied under recommended operating conditions. Note that the current conducted during the pulse by the RAM inputs, outputs and power supply may significantly exceed the normal operat- ing levels. The application design must accommodate these effects. Neutron Radiation The SRAM will meet any functional or timing specification after exposure to the specified neutron fluence under recommended operating or storage conditions. This as- sumes an equivalent neutron energy of 1 MeV. Soft Error Rate The SRAM is immune to single event upsets (SEU’s) to the specified soft error rate (SER), under recommended oper- ating conditions. This hardness level is defined by the Adams 10% worst case cosmic ray environment for geo- synchronous orbits. Latchup The SRAM will not latch up due to any of the above radiation exposure conditions when applied under recom- mended operating conditions. Fabrication with the SIMOX substrate material provides oxide isolation between adja- cent PMOS and NMOS transistors and eliminates any potential SCR latchup structures. Sufficient transistor body tie connections to the p- and n-channel substrates are made to ensure no source/drain snapback occurs. RADIATION CHARACTERISTICS |
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