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S30MS512P25BFW503 Datasheet(PDF) 9 Page - SPANSION |
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S30MS512P25BFW503 Datasheet(HTML) 9 Page - SPANSION |
9 / 41 page August 4, 2006 S30MS-P_00_A7 S30MS-P ORNANDTM Flash Family 7 Da ta Shee t (Prelim i nar y ) 3. Physical Dimensions 3.1 VBP137—137-Ball Fine Pitch Ball Grid Array (FBGA) 0.08 M MC A B C C C 6 b 0.15 SIDE VIEW 137X 0.08 7 SE E1 D1 10 9 8 6 4 5 2 1 3 e 7 e A CORNER PIN A1 C D E F G H J K L M N 7 SD BOTTOM VIEW P C B A D E 0.15 (2X) C B C 0.15 (2X) 9 TOP VIEW PIN A1 CORNER A2 A INDEX MARK A1 0.10 3549 \ 16-038.25 \ 2.16.6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. 3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT AS NOTED). 4. e REPRESENTS THE SOLDER BALL GRID PITCH. 5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE "D" DIRECTION. SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE "E" DIRECTION. N IS THE TOTAL NUMBER OF SOLDER BALLS. 6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A PLANE PARALLEL TO DATUM C. 7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A AND B AND DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW. WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW PARALLEL TO THE D OR E DIMENSION, RESPECTIVELY, SD OR SE = 0.000. WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW, SD OR SE = e/2 8. NOT USED. 9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS. 10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION OR OTHER MEANS. PACKAGE VBP 137 JEDEC N/A 13.00 mm x 11.00 mm NOM PACKAGE SYMBOL MIN NOM MAX NOTE A --- --- 1.00 OVERALL THICKNESS A1 0.17 --- --- BALL HEIGHT A2 0.60 --- 0.76 BODY THICKNESS D 13.00 BSC. BODY SIZE E 11.00 BSC. BODY SIZE D1 10.40 BSC. BALL FOOTPRINT E1 7.20 BSC. BALL FOOTPRINT MD 14 ROW MATRIX SIZE D DIRECTION ME 10 ROW MATRIX SIZE E DIRECTION N 137 TOTAL BALL COUNT φb 0.35 0.40 0.45 BALL DIAMETER e 0.80 BSC. BALL PITCH SD / SE 0.40 BSC. SOLDER BALL PLACEMENT G5,H5,H6 DEPOPULATED SOLDER BALLS |
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