Amplifier, Power, S/C-Band, 1.6W

2.5-5.5 GHz

MAAPGM0035S-DIE

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903179 —

Preliminary Information

4

Mechanical Information

Chip Size: 3.000 x 3.000 x 0.075 mm

Figure 5. Die Layout

Pad

Size (

μm)

RF In and Out

100 x 200

DC Drain Supply Voltage VDD

300 x 150

DC Gate Supply Voltage VGG

150 x 100

Size (mils)

4 x 8

12 x 6

6 x 4

Bond Pad Dimensions