2

S75NS-N

S75NS-N_00_01E May 3, 2006

Data

Sheet

(Adva n ce

In fo rma t io n)

1.

Ordering Information

The ordering part number is formed by a valid combination of the following:

1.1

Valid Combinations

Valid Combinations list configurations planned to be supported in volume for this device. Consult your local

sales office to confirm availability of specific valid combinations and to check on newly released

combinations.

Notes:

1. Type 0 is standard. Specify other options as required.

2. The package marking omits the leading S and packing type designator from the ordering part number.

3. Contact factory for availability of any of the OPNs listed because RAM type availability may vary over time.

S75NS 128

N

B

G

J

W

JZ

0

Packing Type

0 = Tray

2 = 7-inch Tape and Reel

3 = 13-inch Tape and Reel

Model Number

Refer to the Valid Combinations table below

Temperature Range

W = Wireless (-25°C to +85°C)

Package Type

J = 1.4 mm height, 0.5mm ball size, Thin Fine-Pitch Ball Grid

Array (FBGA) Lead (Pb)-free Package (LF35)

ORNAND Data Density

F = 512 Mb

G = 01 Gb

pSRAM Density

B = 32 Mb

C = 64 Mb

Process Technology

N = 110 nm MirrorBit Technology

Flash Density

256 = 256 Mb

128 = 128 Mb

Device Family

S75NS = Multi-Chip Product 1.8 Volt-only Simultaneous Read/

Write Burst Mode Multiplexed Flash Memory + pSRAM +

ORNAND Data Storage

Table 1.1 MCP Configurations and Valid Combinations

Base Ordering Part

Number (Note 2)

Package &

Temperature

Model

Number

Packing

Type

pSRAM Type

Flash Speed

Options

pSRAM Speed

Options

S75NS128NBF

UJW

JZ

0, 2, 3

pSRAM Type 3

66 MHz

66 MHz

S75NS128NBG

JZ

pSRAM Type 3

66 MHz

66 MHz