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S71GL256NC0 Datasheet(PDF) 11 Page - SPANSION |
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S71GL256NC0 Datasheet(HTML) 11 Page - SPANSION |
11 / 122 page December 17, 2004 S71GL512_256_128NC0_00_A0 11 Ad vance Info rmat i o n Ordering Information The order number (Valid Combination) is formed by the following: S71GL 512 N C0 BA W E Z 0 PACKING TYPE 0= Tray 2 = 7” Tape and Reel 3 = 13” Tape and Reel MODEL NUMBER Z = Refer to the Valid Combinations Table PACKAGE MODIFIER A = 1.2 mm height, 8 x 11.6 mm, 84 balls FBGA E = 1.2 mm height, 9 x 12.0 mm, 84 balls FBGA TEMPERATURE RANGE W = Wireless (-25 °C to +85°C) PACKAGE TYPE BA = Very Thin Fine-pitch BGA Lead (Pb)-free compliant package BF = Very Thin Fine-pitch BGA Lead (Pb)-free package pSRAM DENSITY C0 = 64 Mb pSRAM PROCESS TECHNOLOGY N = 110 nm, MirrorBitTM Technology FLASH DENSITY 512 = 512 Mb 256 = 256 Mb 128 = 128 Mb PRODUCT FAMILY S71GL Multi-chip Product (MCP) 3.0 Volt-only Uniform Sector Page Mode Flash Memory with pSRAM |
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