June 20, 2006 S71GL016A_00_A1

S71GL016A Based MCPs

5

Da ta

S h ee t

(A dv an c e

In f o r m a t i o n)

6.

Ordering Information

The order number is formed by a valid combinations of the following:

6.1

Valid Combinations

Valid Combinations list configurations planned to be supported in volume for this device. Consult your local

sales office to confirm availability of specific valid combinations and to check on newly released

combinations.

Note:

Type 0 is standard. Specify other options as required.

S71GL

016

A

40

BA

W

3J

0

Packing Type

0= Tray

2

= 7” Tape and Reel

3

= 13” Tape and Reel

Model Number

See the Valid Combinations table

Temperature Range

W = Wireless (-25×C to +85×C)

Package Type

BA = Fine-pitch BGA Lead (Pb)-free compliant package

BF = Fine-pitch BGA Lead (Pb)-free package

pSRAM Density

40 = 4 Mb pSRAM

Process Technology

A = 200 nm, MirrorBit Technology

Flash Density

016= 16Mb

Product Family

S71GL Multi-chip Product (MCP) 3.0-volt Page Mode Flash Memory and RAM

Base Ordering

Part Number

Package &

Temperature

Package Modifier/

Model Number

Packing

Type

Speed Options (ns)/

Boot Sector Option

pSRAM Type/

Access Time (ns)

Package

Marking

S71GL016A40

BAW

3J

0, 2, 3

(See Note)

100 / Bottom Boot Sector

pSRAM4/ 70

TLC056

S71GL016A40

1J

100 / Top Boot Sector

S71GL016A40

BFW

3J

100 / Bottom Boot Sector

S71GL016A40

1J

100 / Top Boot Sector