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BGY2016 Datasheet(PDF) 7 Page - NXP Semiconductors |
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BGY2016 Datasheet(HTML) 7 Page - NXP Semiconductors |
7 / 12 page 2000 Jan 04 7 Philips Semiconductors Product specification UHF amplifier module BGY2016 PACKAGE OUTLINE UNIT Q bp Z c e U2 U1 U Fp q REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE 99-02-06 IEC JEDEC EIAJ mm 4.0 3.8 0.56 0.46 A 9.5 9.0 0.3 0.2 D 30.1 29.9 E 18.6 18.4 12.8 12.6 4.1 3.9 40.74 40.54 2.54 e1 17.78 3.25 3.15 L 6.5 6.1 7.75 7.55 15.4 15.2 48.0 48.4 0.3 0.25 vw 0.1 y DIMENSIONS (mm are the original dimensions) SOT365A 0 10 20 mm scale Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads SOT365A p U2 F A U1 U D q E L y Q c v A A w M bp Z 23 4 1 e1 e e |
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