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HBAT-5400-TR2 Datasheet(PDF) 8 Page - Agilent(Hewlett-Packard) |
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HBAT-5400-TR2 Datasheet(HTML) 8 Page - Agilent(Hewlett-Packard) |
8 / 8 page The key factors in these equations are: RS, the series resistance of the diode where heat is generated under high current conditions; θchip, the chip thermal resistance of the Schottky die; and θpackage, or the package thermal resistance. RS for the HBAT-540x family of diodes is typically 2.4 Ω, other than the HSMS-270x family, this is the lowest of any Schottky diode available. Chip thermal resistance is typically 40 °C/W; the thermal resistance of the iron-alloy- leadframe, SOT-23 package is typically 460 °C/W; and the thermal resistance of the copper- leadframe, SOT-323 package is typically 110 °C/W. The impact of Part Number Ordering Information Part Number No. of Devices Container HBAT-5400-BLK 100 Antistatic Bag HBAT-5400-TR1 3,000 7" Reel HBAT-5400-TR2 10,000 13" Reel HBAT-5402-BLK 100 Antistatic Bag HBAT-5402-TR1 3,000 7" Reel HBAT-5402-TR2 10,000 13" Reel HBAT-540B-BLK 100 Antistatic Bag HBAT-540B-TR1 3,000 7" Reel HBAT-540B-TR2 10,000 13" Reel HBAT-540C-BLK 100 Antistatic Bag HBAT-540C-TR1 3,000 7" Reel HBAT-540C-TR2 10,000 13" Reel HBAT-540E-BLK 100 Antistatic Bag HBAT-540E-TR1 3,000 7" Reel HBAT-540E-TR2 10,000 13" Reel HBAT-540F-BLK 100 Antistatic Bag HBAT-540F-TR1 3,000 7" Reel HBAT-540F-TR2 10,000 13" Reel package thermal resistance on the current handling capability of these diodes can be seen in Figures 3 and 4. Here the com- puted values of junction tempera- ture vs. forward current are shown for three values of ambient temperature. The SOT-323 prod- ucts, with their copper leadframes, can safely handle almost twice the current of the larger SOT-23 diodes. Note that the term “ambient temperature” refers to the temperature of the diode’s leads, not the air around the circuit board. It can be seen that the HBAT-540B and HBAT-540C products in the SOT-323 package will safely withstand a steady-state forward current of 330 mA when the diode’s terminals are maintained at 75 °C. For pulsed currents and transient current spikes of less than one microsecond in duration, the junction does not have time to reach thermal steady state. Moreover, the diode junction may be taken to temperatures higher than 150 °C for short timeperiods without impacting device MTTF. Because of these factors, higher currents can be safely handled. The HBAT-540x family has the second highest current handling capability of any Agilent diode, next to the HSMS-270x series. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (65) 6756 2394 India, Australia, New Zealand: (65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (65) 6755 2044 Taiwan: (65) 6755 1843 Data subject to change. Copyright © 2003 Agilent Technologies, Inc. Obsoletes 5968-7959E March 24, 2004 5989-0472EN Note : For lead-free option, the part number will have the character "G" at the end, eg. HBAT-540x-TR2G for a 10,000 lead-free reel. |
Similar Part No. - HBAT-5400-TR2 |
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Similar Description - HBAT-5400-TR2 |
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