Specifications and information are subject to change without notice.

WJ Communications, Inc

• Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com

Page 8 of 9 June 2005

AH215 / ECP100G

1 Watt, High Gain HBT Amplifier

Product Information

AH215-S8G (Lead-Free Package) Mechanical Information

This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free

(maximum 260

°C reflow temperature) and lead (maximum 245°C reflow temperature) soldering processes.

Outline Drawing

Mounting Configuration / Land Pattern

Thermal Specifications

Parameter

Rating

Operating Case Temperature

-40 to +85

° C

33

° C / W

159

° C

Notes:

1. The thermal resistance is referenced from the junction-to-

case at a case temperature of 85

° C. Tjc is a function of

the voltage at pins 6 and 7 and the current applied to pins

6, 7, and 8 and can be calculated by:

Tjc = Tcase + Rth * Vcc * Icc

2. This corresponds to the typical biasing condition of +5V,

450 mA at an 85

° C case temperature. A minimum

MTTF of 1 million hours is achieved for junction

temperatures below 247

° C.

Product Marking

The component will be marked with an

“AH215-S8G” designator with an alphanumeric

lot code on the top surface of the package.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

ESD / MSL Information

ESD Rating: Class 1B

Value:

Passes

/500V to <1000V

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

MSL Rating: Level 2 at +260

° C convection reflow

Standard:

JEDEC Standard J-STD-020

Mounting Config. Notes

1. A heatsink underneath the area of the PCB for the mounted device

is strictly required for proper thermal operation. Damage to the

device can occur without the use of one.

2. Ground / thermal vias are critical for the proper performance of this

device. Vias should use a .35mm (#80 / .0135”) diameter drill and

have a final plated thru diameter of .25 mm (.010”).

3. Add as much copper as possible to inner and outer layers near the

part to ensure optimal thermal performance.

4. Mounting screws can be added near the part to fasten the board to a

heatsink. Ensure that the ground / thermal via region contacts the

heatsink.

5. Do not put solder mask on the backside of the PC board in the

region where the board contacts the heatsink.

6. RF trace width depends upon the PC board material and

construction.

7. Use 1 oz. Copper minimum.

8. All dimensions are in millimeters (inches). Angles are in degrees.

MTTF vs. GND Tab Temperature

100

1000

10000

100000

1000000

50

60

70

80

90

100

Tab temperature (° C)