Specifications and information are subject to change without notice

WJ Communications, Inc

Phone 1-800-WJ1-4401 FAX: 408-577-6621

e-mail: sales@wj.com

Web site: www.wj.com

Page 6 of 6 April 2006

AH114

¼ Watt, High Linearity InGaP HBT Amplifier

Product Information

AH114-89G (Green / Lead-free SOT-89 Package) Mechanical Information

This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260

qC reflow temperature) and leaded

(maximum 245

qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.

Outline Drawing

Land Pattern

Thermal Specifications

Parameter

Rating

Operating Case Temperature

-40 to +85

qC

149

qC / W

197

qC

Notes:

1. The thermal resistance is referenced from the junction-to-case at a case

temperature of 85 C.

2. This corresponds to the typical biasing condition of +5V, 150 mA at an 85

C case temperature. A minimum MTTF of 1 million hours is achieved

for junction temperatures below 247 C.

Product Marking

The component will be marked with an “AH114

G” designator with an alphanumeric lot code on

the top surface of the package. The obsolete tin-

lead package is marked with an “AH114” or

“E009” designator followed by an alphanumeric

lot code.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

ESD / MSL Information

ESD Rating: Class 1A

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

MSL Rating: Level 3 at +260 C convection reflow

Standard:

JEDEC Standard J-STD-020

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper performance of this

device. Vias should use a .35mm (#80 / .0135”) diameter drill and

have a final plated thru diameter of .25 mm (.010” ).

2. Add as much copper as possible to inner and outer layers near the

part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the board to a

heatsink. Ensure that the ground / thermal via region contacts the

heatsink.

4. Do not put solder mask on the backside of the PC board in the

region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material and

construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are in degrees.

MTTF vs. GNDTab Temperature

1.0

10.0

100.0

1000.0

60

70

80

90

100

110

120

TabTemperature(°C)