HY64LD16162M Series

3

Revision 1.7

March. 2002

Note

1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent

damage to the device. This is stress rating only and the functional operation of the device under these or

any other conditions above those indicated in the operation of this specification is not implied. Exposure

to the absolute maximum rating conditions for extended period may affect reliability.

TRUTH TABLE

Power

Standby

/CS1

H

CS2

H

/WE

X

/OE

X

/LB

X

/UB

X

Mode

Deselected

I/O1~I/O8

High-Z

I/O9~I/O16

High-Z

I/O Pin

X

X

L

L

L

L

L

L

L

L

L

L

H

H

H

H

H

H

H

H

H

H

X

X

L

H

H

L

H

H

L

H

H

X

X

X

L

H

X

L

H

X

L

H

X

H

L

L

L

H

H

H

L

L

L

X

H

H

H

H

L

L

L

L

L

L

Deselected

Deselected

Write

Read

Output Disabled

Write

Read

Output Disabled

Write

Read

Output Disabled

High-Z

High-Z

High-Z

High-Z

High-Z

High-Z

High-Z

High-Z

High-Z

High-Z

High-Z

High-Z

High-Z

High-Z

Deep Power Down

Standby

Active

Active

Active

Active

Active

Active

Active

Active

Active

Note

2. /UB, /LB(Upper, Lower Byte enable)

These active LOW inputs allow individual bytes to be written or read.

When /LB is LOW, data is written or read to the lower byte, I/O1 - I/O8.

When /UB is LOW, data is written or read to the upper byte, I/O9 - I/O16.

ORDERING INFORMATION

Part Number

Speed

Package

HY64LD16162M-E

85

FBGA

HY64LD16162M-I

85

FBGA

Power

LL-Part

LL-Part

Temperature

Symbol

Parameter

Rating

Remark

Input/Output Voltage

-0.3 to Vdd+0.3

Unit

V

Vdd

Power Supply

-0.3 to 3.6

V

Ambient Temperature

-25 to 85

HY64LD16162M-E

°C

Storage Temperature

-55 to 150

°C

Power Dissipation

1.0

W

Ball Soldering Temperature & Time

260•10

°C•sec

-40 to 85

HY64LD16162M-I

°C

Note

1. E : Extended Temp. (-25

°C ~ 85°C)

2. I : Industrial Temp. (-40

°C ~ 85°C)