SN65LVDS125A

SN65LVDT125A

SLLS595A − OCTOBER 2003 − REVISED FEBRUARY 2004

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4

CROSSPOINT LOGIC TABLES

OUTPUT CHANNEL 1

OUTPUT CHANNEL 2

OUTPUT CHANNEL 3

OUTPUT CHANNEL 4

CONTROL

PINS

INPUT

SELECTED

CONTROL

PINS

INPUT

SELECTED

CONTROL

PINS

INPUT

SELECTED

CONTROL

PINS

INPUT

SELECTED

S10

S11

1Y/1Z

S20

S21

2Y/2Z

S30

S31

3Y/3Z

S40

S41

4Y/4Z

0

0

1A/1B

0

0

1A/1B

0

0

1A/1B

0

0

1A/1B

0

1

2A/2B

0

1

2A/2B

0

1

2A/2B

0

1

2A/2B

1

0

3A/3B

1

0

3A/3B

1

0

3A/3B

1

0

3A/3B

1

1

4A/4B

1

1

4A/4B

1

1

4A/4B

1

1

4A/4B

PACKAGE DISSIPATION RATINGS

PACKAGE

CIRCUIT BOARD

MODEL

TA ≤ 25°C POWER

RATING

DERATING FACTOR(1)

ABOVE TA = 25°C

TA = 85°C POWER

RATING

TSSOP (DBT)

High−K(2)

1772 mW

15.4 mW/

°C

847 mW

(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounded and with no air flow.

(2) In accordance with the High−K thermal metric definitions of EIA/JESD51−6

THERMAL CHARACTERISTICS

PARAMETER

TEST CONDITIONS

VALUE

UNITS

θJB

Junction-to-board thermal resistance

40.3

°C/W

θJC

Junction-to-case thermal resistance

8.5

°C/W

PD

Device power dissipation

Typical

VCC = 3.3 V, TA = 25°C, 750 MHZ

356

mW

PD

Device power dissipation

Maximum

VCC = 3.6 V, TA = 85°C, 750 MHZ

522

mW

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

UNITS

Supply voltage range, vcc

−0.5 V to 4 V

S, DE

−0.5 V to 4 V

Voltage range

(A, B)

−0.5 V to 4 V

Voltage range

|VA − VB| (LVDT only)

1 V

(Y, Z)

−0.5 V to 4 V

Electrostatic discharge

Human body model(3)

All pins

±3 kV

Electrostatic discharge

Charged-device model(4)

All pins

±500 V

Continuous power dissipation

See Dissipation Rating Table

Storage temperature range

−65

°C to 150°C

(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.

(3) Tested in accordance with JEDEC Standard 22, Test Method A114-A.

(4) Tested in accordance with JEDEC Standard 22, Test Method C101.