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3B03 Datasheet(PDF) 1 Page - Analog Devices |
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3B03 Datasheet(HTML) 1 Page - Analog Devices |
1 / 6 page 3B Series 4 Channel Backplane 3B03 Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.326.8703 © 2005 Analog Devices, Inc. All rights reserved. FEATURES Mix and Match 3B Series I/O Module Capability Factory Mutual (FM) Approved CE Certified +1500 V peak Channel/Channel and Input/Output Isolation -25oC to +85oC Temperature Range LEDs indicate when power is applied Replaceable AC Line Fuse in Protective Housing Versatile Mounting Options APPLICATIONS Industrial Signal Conditioning Industrial Signal Isolation Industrial Signal Filtering PRODUCT OVERVIEW To address diverse applications, the 3B Subsystem Series includes a family of backplanes which provide a complete signal conditioning solution. The 3B03 is designed for 4 channels to offer users the flexibility to match the size of a system to specific applications. All backplanes are provided with #6-32 x 1-inch screws and standoffs for mounting. Several mounting options are available, including rack, surface and NEMA enclosure. All 3B Series modules feature a universal pin out and can be easily tailored to fit the user’s application. Each backplane can accommodate any 3B Series module in a “Mix and Match” arrangement. Modules are “Hot Swappable”; power does not have to be removed when inserting or removing any module on the backplane. All backplanes provide a four screw terminal for each individual channel’s input field connections. These connections satisfy all transducer inputs and provide transducer excitation when necessary. FUNCTIONAL BLOCK DIAGRAM Figure 1 3B03 Functional Block Diagram A cold junction temperature sensor is also supplied on each channel to accommodate thermocouple input modules. Each channel has two screw terminals for the output connections for the 4-20 mA output signals. Two 26-pin system connectors provide high level voltage I/O for all channels. Figure 1 illustrates the 3B Series backplane functional block diagram. In addition, complete specifications are shown in the table below. |
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