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June 20, 2000

79RC32364™

*Notice: The information in this document is subject to change without notice

RC32364 also provides Ack*, Retry*, and BusErr* signals. This device

also provides I/D* signals, to indicate whether instructions or data is

being transferred. The Last* signal is provided to indicate that the last

data transfer is in progress.

The RC32364 provides six external interrupt signals: INT*[5:0] and

a non-maskable interrupt (NMI*) signal.

To share the system interface bus, the RC32364 provides BusReq*

and BusGnt* signals to interface external DMA masters. To allow the

external master control of the external bus, a DMA arbiter is provided.

The RC32364 supports a variable bus width interface, enabling the

CPU to operate with a mix of 8-bit, 16-bit, and 32-bit wide memories.

To indicate the width of the memory or I/O space being accessed, the

RC32364 provides two output signals, Width[1:0]. The width of various

address spaces is programmed using the Port Width Control Register.

The RC32364’s physical memory is divided into several regions, and

each region’s width can be programmed by using this register. Within

these regions, the bus turnaround time can also be programmed.

Thus, the RC32364 can be simply mated with low-cost external

memory subsystems. The large on-chip caches and the early restart

serve to allow the processor to achieve high-performance even with

such low-cost memory.

The RISCore32300 offers a number of features relevant to low-

power systems, including low-power design, active power manage-

ment and power-down modes of operation. The RISCore32300 is a

static design. The RC32364 supports a WAIT instruction which is

designed to signal the rest of the chip that execution and clocking should

be halted, reducing system power consumption during idle periods.

Thermal Considerations

Thermal Considerations

Thermal Considerations

Thermal Considerations

The RC32364 is a low-power CPU, consuming approximately 0.9W

peak power. Thus, no special packaging considerations are required.

The RC32364 is guaranteed in a case temperature range of 0

° to

+85

° C, for commercial temperature devices; - 40° to +85° for industrial

temperature devices. The type of package, speed (power) of the device,

and airflow conditions affect the equivalent ambient temperature condi-

tions that will meet this specification.

using the thermal resistance from case to ambient (

package. The following equation relates ambient and case tempera-

tures:

where P is the maximum power consumption at hot temperature,

Typical values for

that the RC32364 implements advanced power management, which

substantially reduces the average power dissipation of the device.

Revision Histor

Revision Histor

Revision Histor

Revision Historyyyy

August 1999: Changed references from MIPS-II to MIPS 32.

Changed references from MIPS-IV to MIPS 64. Changed values in

Clock Parameters Table, System Interface Parameters Table, and

Power Consumption Table. Deleted Several Timing Diagrams. Added

JTAG TIming Diagram.

Jan. 12, 2000: Corrected information regarding the TRST* signal in

Table 3. TRST* requires an external pull-down on the board.

April 4, 2000: Adjusted values for DCLK in the System Interface

Parameters table. Added Power Curves.

June 20, 2000: Changed times for the Data Output Hold, TDO

Output Delay Time, and TPC Output Delay Time parameters in the

System Interface Parameters table. Revised values for PCST Output

Delay Time in System Interface Parameters table.

Airflow (ft/min)

0

200

400

600

800

1000

144 TQFP

27

22

20

17

15

14

Table 2 Thermal Resistance (

∅CA) at Various Airflows