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TPS65820RSHR Datasheet(PDF) 4 Page - Texas Instruments |
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TPS65820RSHR Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 94 page  www.ti.com ABSOLUTE MAXIMUM RATINGS DISSIPATION RATINGS TPS65820 SLVS663 – MAY 2006 over operating free-air temperature range (unless otherwise noted)(1) VALUE UNIT AC and USB with respect to AGND1 –0.3 to 18 ANLG1, ANLG2 with respect to AGND2 –0.3 to V(OUT) V(OUT) with respect to AGND1 5 VIN_LDO12 , VIN_LDO35, LDO3, LDO4, LDO5 with respect to AGND2 –0.3 to V(OUT) LDO35_REF, ADC_REF with respect to AGND2 –0.3 to smaller of: 3.6 or V(OUT) SIM, RTC_OUT with respect to AGND1 –0.3 to smaller of: 3.6 or V(OUT) SM1, L1, VIN_SM1 with respect to PGND1 –0.3 to V(OUT) V SM2, L2, VIN_SM2 with respect to PGND2 –0.3 to V(OUT) SM3, L3 with respect to PGND3 –0.3 to 29 SM3SW with respect to PGND3 –0.3 to V(OUT) FB3 with respect to PGND3 –0.3 to 0.5 All other pins (except AGND and PGND), with respect to AGND1 –0.3 to V(OUT) AGND2, AGND0, PGND1, PGND2, PGND3 with respect to AGND1 –0.3 to +0.3 Input Current, AC pin 2750 Input Current, USB pin 600 Output continuous current, OUT pin 3000 mA Output conitnuous current, BAT pin –3000 Continuous Current at L1, PGND1, L2, PGND2 1800 TA Operating free-air temperature –40 to 85 TJ Maximum junction temperature 125 °C TSTG Storage temperature –65 to 150 Lead temperature 1,6 mm (1/16-inch) from case for 10 seconds 260 ESD rating, all pins 1.5 kV (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. TA≤ 55°C DERATING FACTOR PACKAGE θ JA POWER RATING ABOVE TA = 55°C RSH (1)(2) 21.7 °C/W 3.22 W 0.046 W/ °C (1) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is connected to the ground plane by a via matrix. (2) The RSH package MSL Level : HIR3 at 260 °C 4 Submit Documentation Feedback |
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