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MCP6G04 Datasheet(PDF) 5 Page - Microchip Technology |
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MCP6G04 Datasheet(HTML) 5 Page - Microchip Technology |
5 / 36 page © 2006 Microchip Technology Inc. DS22004A-page 5 MCP6G01/2/3/4 FIGURE 1-1: Gain Select Timing Diagram. GSEL High to Valid Output Time, G = +10 to +50 Select tGSH10 — 12 —µs VIN = 30 mV, GSEL = 0.75VDD to VOUT = 1.38V GSEL Low to Valid Output Time, G = +50 to +10 Select tGSL50 — 9 —µs VIN = 30 mV, GSEL = 0.25VDD to VOUT = 0.42V DIGITAL ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, TA = 25°C, VDD = +1.8V to +5.5V, VSS = GND, G = +1 V/V, VIN = (0.3V)/G, RL = 100 kΩ to VDD/2, CL = 60 pF, GSEL = VDD/2, and CS is tied low. Parameters Sym Min Typ Max Units Conditions Note 1: GSEL is a tri-level input pin. The gain is 10 when its voltage is low, 1 when it is at mid-suppy, and 50 when it is high. 2: Not tested in production. Set by design and characterization. 3: ISS_SHDN includes the current through the CS pin, RL and RLAD, and excludes digital switching currents. The block dia- gram on the from page shows these current paths (through VSS). TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = +1.8V to +5.5V, and VSS = GND. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range TA –40 — +125 °C Operating Temperature Range TA –40 — +125 °C (Note 1) Storage Temperature Range TA –65 — +150 °C Thermal Package Resistances Thermal Resistance, 8L-SOIC θJA — 163 — °C/W Thermal Resistance, 8L-MSOP θJA — 206 — °C/W Thermal Resistance, 14L-SOIC θJA — 120 — °C/W Thermal Resistance, 14L-TSSOP θJA — 100 — °C/W Note 1: The MCP6G01/2/3/4 family of SGAs operates over this temperature range, but operation must not cause TJ to exceed Maximum Junction Temperature (+150°C). GSEL VOUT tGSL1 0.15V 1.50V VIN 0.150V 0.030V 0.15V tGSM10 0.03V 1.50V tGSH1 0.03V tGSM50 0.30V 1.50V tGSH10 0.30V tGSL50 |
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