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CS3160 Datasheet(PDF) 4 Page - Applied Micro Circuits Corporation |
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CS3160 Datasheet(HTML) 4 Page - Applied Micro Circuits Corporation |
4 / 11 page 4 AMCC Confidential and Proprietary Revision A – August 12, 2004 Data Sheet S3160 – 2.5 Gbps Wide Bandwidth Transimpedance Amplifier Figure 3. S3160 Bonding Pad Location Note: Pad Size is 94 µm X 94 µm. The exposed area of the pad is 80 µm X 80 µm. Die thickness is 254 µm (10 mils). 1. The circuit die size is the smallest possible size of the die. The lower left-hand corner of the circuit die is the origin of the xy-coordinate system. Pad coordinates indicated in Table 1 are measured from this origin to the pad's center. 2. The total die size is the largest possible size of the die. It includes a splicing area around the circuit die. The actual size of any given die may vary in size from the minimum (circuit die) size to the maximum (total die) size. VCC RBYPASS IIN RBYPASS GND GND GND GND OUTN OUTP FILT VCC VCC VCC VCC 12 3 4 5 6 7 8 9 10 11 12 13 14 15 1.15 mm (Circuit Die Size) 1.27 mm (Total Die Size) Total Die Size 2 X-Axis Y-Axis (0,0) Circuit Die Size 1 |
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