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FUNCTIONAL BLOCK DIAGRAM

DATA

BCLK

LRCLK

INPUT

BUFFER

OUTPUT

BUFFER

DATA_OUT

CONTROL

5

DELx(4:0)

DELAY

MEMORY

ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATINGS

(1)

RECOMMENDED OPERATING CONDITIONS

TPA5052

SLOS500A – JUNE 2006 – REVISED AUGUST 2006

VALUE

UNIT

Supply voltage

–0.3 to 3.6

V

Input voltage

DATA, LRCLK, BCLK, DEL[4:0]

–0.3 to 5.5

V

Continuous total power dissipation

See Dissipation Rating Table

Operating free-air temperature range

–40 to 85

°C

Operating junction temperature range

–40 to 125

°C

Storage temperature range

–65 to 125

°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

PACKAGE

DERATING

POWER RATING

FACTOR

POWER RATING

POWER RATING

RSA

2.5 W

25 mW/

°C

1.375 W

1 W

(1)

This data was taken using 1 oz trace and copper pad that is soldered directly to a JEDEC standard high-k PCB. The thermal pad must

be soldered to a thermal land on the printed-circuit board. See TI Technical Briefs SCBA017D and SLUA271 for more information about

using the QFN thermal pad.

MIN

MAX

UNIT

Supply voltage

VDD

3

3.6

V

High-level input voltage

DATA, LRCLK, BCLK, DEL[4:0]

2

V

Low-level input voltage

DATA, LRCLK, BCLK, DEL[4:0]

0.8

V

Operating free-air temperature

–40

85

°C

3

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