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MAX6514UKP095 Datasheet(PDF) 5 Page - Maxim Integrated Products |
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MAX6514UKP095 Datasheet(HTML) 5 Page - Maxim Integrated Products |
5 / 8 page Applications Information Temperature-Window Alarm The MAX6515 logic output asserts when the die tem- perature is outside the factory-programmed range. Combining the outputs of two devices creates an over/undertemperature alarm. Two MAX6515s are used to form two complementary pairs, containing one cold trip-point output and one hot trip-point output. The assertion of either output alerts the system to an out-of- range temperature (Figure 1). The thermal overrange signal can be used to assert a thermal shutdown, power-up, recalibration, or other temperature-dependent function. Low-Cost, Fail-Safe Temperature In high-performance/high-reliability applications, multi- ple temperature monitoring is important. The high-level integration and low cost of the MAX6514/MAX6515 facilitate the use of multiple temperature monitors to increase system reliability. The Figure 2 application uses two MAX6514s with different hot-temperature thresholds to ensure that fault conditions that can over- heat the monitored device cause no permanent dam- age. The first temperature monitor activates the fan when the die temperature exceeds +45°C. The second MAX6514 triggers a system shutdown if the die temper- ature reaches +75°C, preventing damage from a wide variety of destructive fault conditions, including latchups, short circuits, and cooling-system failures. Thermal Considerations The MAX6514/MAX6515 supply current is typically 22µA. When used to drive high-impedance loads, the devices dissipate negligible power and self-heating effects are minimized. Accurate temperature monitoring depends on the ther- mal resistance between the device being monitored and the MAX6514/MAX6515 die. Heat flows in and out of plastic packages, primarily through the leads. Pin 2 of the 5-pin SOT23 package provides the lowest ther- mal resistance to the die. Short, wide copper traces between the MAX6514/MAX6515 and the objects whose temperature is being monitored ensure heat transfers occur quickly and reliably. The rise in die tem- perature due to self-heating is given by the following formula: ∆TJ = PDISSIPATION x θJA where PDISSIPATION is the power dissipated by the MAX6514/MAX6515, and θJA is the thermal resistance of the package. The typical thermal resistance is +140°C/W for the 5- pin SOT23 package. To limit the effects of self-heating, minimize the output current. For example, if the MAX6514/MAX6515 sink 1mA, the open-drain output voltage is guaranteed to be less than 0.3V. Therefore, an additional 0.3mW of power is dissipated within the IC. This corresponds to a 0.042°C shift in the die tem- perature in the 5-pin SOT23 package. Low-Cost, 2.7V to 5.5V Temperature Switches in a SOT23 _______________________________________________________________________________________ 5 MAX6515UKP075 MAX6515UKN005 VCC VCC +5V 100kΩ GND GND HYST TUNDER TOVER GND OUT OF RANGE GND HYST VCC +5V SYSTEM SHUTDOWN MAX6514UKP075 GND µP GND HYST TOVER VCC FAN CONTROL MAX6514UKP045 GND GND TOVER HYST GND HEAT HEAT Figure 1. Temperature-Window Alarms Using the MAX6515 Figure 2. Low-Power, High-Reliability, Fail-Safe Temperature Monitor |
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