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SMD type chip
Chip thermistors are specially processed, highly
reliable thermistors.
They can be face-bonded to act as thermal
compensators for ICs and they are manufactured
in sizes down to 1 square mm, they can also be
used to detect temperature with relatively small
time constants.
Precautions
Dimensions
Reflow soldering profile
103 K T 2125T -
Rated zero-power resistance at 25 C 103:10k
Part number
Chip thermistor
1P: 1%,2P: 2%,3P: 3%
Dimension(EIAJ) 2125
Specifications
Part No.
R25
*1
B value*
2
Dissipation factor
(mW/ C)
Thermal time
constant(s)*
3
Operating temp.
range( C)
Rated power
at 25 C(mW)
*1 R25 : Rated zero-power resistance value at 25 C.
*2 B value : determined by rated zero-power resistance at 25 C and 85 C.
*3 Time when thermistor temperature reaches 63.2% of the temperature difference. The value is measured in the air.
Other resistance is available, please ask.
103KT2125T
103KT1608T
503KT1608T
104KT1608T
103KT1005T
10k
10k
50k
100k
10k
3435K 1%
3435K 1%
4055K 1%
4390K 1%
3435K 1%
1.0
0.9
0.9
0.9
0.7
7.5
5.0
5.0
5.0
2.2
5.0
4.5
4.5
4.5
3.5
40 125
40 125
40 125
40 125
40 125
Unit(mm)
1.5
(1.0 0.1)
1.65 0.2
4.0 0.1
4.0 0.1
2.0 0.05
1.5max.
(0.25max.)
( ):1608type
0.3max.
0.1
0
Taping (2125, 1608 type)
Do not expose the thermistors to high
soldering heat for more than specified time.
(260 C for not longer than 10s is
recommended)
Unit(mm)
L
L
1
L
1
W
Glass coating
Electrode
(Sn plated)
190 C 15 C
260 C 5 C
Time
Soldering
Cooling
Preheat(air)
120s 30s
1 2
C/s
10s
max.
Minimum quantity:4000pcs/reel
Minimum quantity:10000pcs/reel
Unit(mm)
(1005 type)
T
EIA
0402
0603
0805
EIAJ
1005
1608
2125
L
1.00 0.15
1.60 0.15
2.00 0.20
W
0.50 0.10
0.80 0.15
1.25 0.20
T
0.6max.
0.95max.
1.2max.
L1
0.15 0.30
0.20 0.50
0.20 0.50
2.0 0.05
0.66 0.03
0.9max
0.75 0.02
4.0 0.1
0.6 0.10
2.0 0.10
1.5
0.1
0
CHIP TYPE THERMISTOR
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