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TISP4350MMBJR-S Datasheet(PDF) 2 Page - Bourns Electronic Solutions |
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TISP4350MMBJR-S Datasheet(HTML) 2 Page - Bourns Electronic Solutions |
2 / 20 page NOVEMBER 2001 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP43xxMMAJ/BJ Overvoltage Protector Series Description (Continued) Overload Ratings, TA = 25 °C (Unless Otherwise Noted) Absolute Maximum Ratings, TA = 25 °C (Unless Otherwise Noted) The protector consists of a symmetrical voltage-triggered bidirectional thyristor. Overvoltages are initially clipped by breakdown clamping until the voltage rises to the breakover level, which causes the device to crowbar into a low-voltage on state. This low-voltage on state causes the current resulting from the overvoltage to be safely diverted through the device. The high crowbar holding current prevents d.c. latchup as the diverted current subsides. This TISP43xxMM range consists of three voltage variants targeted at specific applications: ADSL, electro-mechanical hook switch and solid state hook switch modems. These parts are guaranteed to voltage limit and withstand the listed international lightning surges in both polarities. Two packages are available; SMB (JEDEC DO-214AA with J-bend leads) and SMA (JEDEC DO-214AC with J-bend leads). These devices are supplied in embossed tape reel carrier pack. For alternative voltage and holding current values, consult the factory. Rating Symbol Value Unit Repetitive peak off-state voltage, ‘4300 ‘4350 ‘4360 VDRM ±230 ±275 ±290 V Non-repetitive peak on-state pulse current (see Notes 2, 3 and 4) ITSP A 2/10 µs (GR-1089-CORE, 2/10 µs voltage wave shape) 250 10/160 µs (FCC Part 68 (TIA/EIA-IS-968), 10/160 µs voltage wave shape) 75 5/320 µs (FCC Part 68 (TIA/EIA-IS-968), 9/720 µs voltage wave shape) 65 5/310 µs (ITU-T K.44, 10/700 µs voltage wave shape used in K.20/45/21) 65 10/560 µs (FCC Part 68 (TIA/EIA-IS-968), 10/560 µs voltage wave shape) 55 10/1000 µs (GR-1089-CORE, 10/1000 µs voltage wave shape) 50 Non-repetitive peak on-state current (see Notes 2, 3 and 4) ITSM 18 7 1.6 A 20 ms (50 Hz) full sine wave 1 s (50 Hz) full sine wave 1000 s 50 Hz/60 Hz a.c. Junction temperature TJ -40 to +150 °C Storage temperature range Tstg -65 to +150 °C NOTES: 1. For voltage values at lower temperatures derate at 0.13 %/°C. 2. Initially, the TISP43xxMM must be in thermal equilibrium with TJ = 25 °C. 3. The surge may be repeated after the TISP43xxMM returns to its initial conditions. 4. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring track widths. Derate current values at -0.61 %/°C for ambient temperatures above 25 °C. Rating Symbol Value Unit Peak overload on-state current, Type A impulse (see Note 5) IT(OV)M 200 100 A 10/160 µs 10/560 µs Peak overload on-state current, a.c. power cross tests UL 60950 (see Note 5) IT(OV)M See Figure 10 for current versus time A NOTE 5: These electrical stress levels may damage the TISP43xxMM silicon chip. After test, the pass criterion is either that the device is functional or, if it is faulty, that it has a short circuit fault mode. In the short circuit fault mode, the following equipment is protected as the device is a permanent short across the line. The equipment would be unprotected if an open circuit fault mode developed. |
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