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TISP4700F3LMFR Datasheet(PDF) 8 Page - Bourns Electronic Solutions |
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TISP4700F3LMFR Datasheet(HTML) 8 Page - Bourns Electronic Solutions |
8 / 11 page NOVEMBER 1997 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MECHANICAL DATA TISP4600F3, TISP4700F3 LM002 (DO-92) 2-Pin Cylindrical Plastic Package This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. LM002 Package (DO-92) MD4XARA 1 3 2 A 3 1 2 VIEW A DIMENSIONS ARE: MILLIMETERS (INCHES) 4.44 - 5.21 (.175 - .205) 3.43 (.135) 4.32 - 5.34 (.170 - .210) 3.17 - 4.19 (.125 - .165) 2.03 - 2.67 (.080 - .105) 0.40 - 0.56 (.016 - .022) 0.35 - 0.41 (.014 - .016) MIN. 2.20 (.086) MAX. 12.7 (0.5) MIN. 1.14 - 1.40 (.045 - .055) 2.41 - 2.67 (.095 - .105) 2.03 - 2.67 (.080 - .105) |
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