JULY 2000 - REVISED FEBRUARY 2005

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

TISP4xx0L3LM Overvoltage Protector Series

Thermal Characteristics

Parameter

Test Conditions

Min

Typ

Max

Unit

Junctio

NOTE 4: EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5 A rated printed wiring track widths.

n to free air thermal resistance

EIA/JESD51-3 PCB, I

= I

,

TTSM(1000)

T= 25 °C, (see Note 4)

A

= 25 °C

A

265 mm x 210 mm populated line card,

4-layer PCB, I

= I

, T

TTSM(1000)

120

57

°C/W