Specifications are subject to change without notice.

Customers should verify device performance in their specific applications.

11

SX(T)10A-3-5SA SIP Non-Isolated Power Module

Operating Information (Continued)

Remote Sense

The Remote Sense feature is used to minimize the effects of distribution losses by regulating the voltage at the Remote Sense pin (See

Figure 29). The voltage between the Sense pin and Vo pin must not exceed 0.5 V.

When the Remote Sense feature is not being used, connect the Remote Sense pin to the output pin of the module.

It is very important to make sure that the maximum output power (Vo x Io) of the module remains less than or equal to the maximum

rated power. Using Remote Sense, the output voltage of the module can increase, which may increase the power output by the module.

Sufficient cooling must always be considered to ensure reliable operation, as these devices operate in a variety of thermal environments.

Factors such as ambient temperature, airflow, power dissipation and reliability must be taken into consideration.

The data presented in Figures 19 to 23 is based on physical test results taken in a wind tunnel test. The test set-up is shown in

Figure 31.

The thermal reference points are (1) Tref1 and Tref2 as shown in Figure 30, and (2) Tref3 = temperature at controller IC. For reliable

operation, none of these Tref points should exceed 115 °C.

Thermal Considerations

V(+)

IN

R

COM

Sense

LOAD

Fig. 29 Remote Sense Circuit Configuration

Fig. 27 Voltage Sequencing at Power Up

Vo: 1 Volt 500

µs

Vseq: 1 Volt 500

µs

(V

= 5.0 V , V = 3.3 V , I = 10.0 A)

in

dc

dc

oo

Fig. 28 Voltage Sequencing at Power Down

Vo: 1 Volt 1 ms

Vseq: 1 Volt 1 ms

(V

= 5.0 V , V = 3.3 V , I = 10.0 A)

in

dc

dc

oo

Time (0.5 ms/div)

Time (0.5 ms/div)