Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Thin Film on Silicon 2QSP / 2NBS -XX3 Dual Terminator

A

.635

(.025)

TYP.

3.81 - 3.99

(.150 - .157)

PIN 1

.21 - .31

(.008 - .012)

1.35 - 1.75

(.053 - .069)

.10 - .25

(.004 - .010)

0-8 °

.19 - .25

(.007 - .010)

.41 - 1.27

(.016 - .050)

5.80 - 6.20

(.228 - .244)

3.81 - 3.99

(.150 - .157)

A

1.27

(.050)

TYP.

PIN 1

0.36 - 0.46

(.014 - .018)

1.35 - 1.75

(.053 - .069)

.10 - .25

(.004 - .010)

0-8 °

.19 - .25

(.007 - .010)

5.80 - 6.20

(.228 - .244)

.41 - 1.27

(.016 - .050)

Model

A

2QSP16

4.80 - 4.98 (.189 - .196)

2QSP20

8.56 - 8.74 (.337 - .344)

2QSP24

8.56 - 8.74 (.337 - .344)

2QSP28

9.80 - 9.98 (.386 - .393)

Governing dimensions are in mm. Dimensions in

parentheses are in inches and are approximate.

JEDEC Reference Number MO-137.

Model

A

2NBS08

4.80 - 4.98 (.189 - .196)

2NBS14

8.56 - 8.74 (.337 - .344)

2NBS16

9.80 - 9.98 (.386 - .393)

Governing dimensions are in mm. Dimensions in

parentheses are in inches and are approximate.

JEDEC Reference Number MS-012.

Mechanical Characteristics

QSOP Package Dimensions

Narrow-Body SOIC Package Dimensions