2FAI-M16R – Integrated Passive & Active Device using MLP

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

I/O PADS

GROUND

PAD

MLP

PACKAGE

General Information

Features

■

Lead free as standard

■

RoHS compliant*

■

ESD protection

■

Protects up to eight data lines

■

Low insertion loss

Applications

■

Cell Phones

■

PDAs and Notebooks

■

GPS and SMART Cards

The 2FAI-M16R device, manufactured using Thin Film on

Silicon technology, provides ESD protection for the external

ports of portable electronic devices such as cell phones,

modems and PDAs.

The ESD protection provided by the component enables a

data port to withstand a minimum ±8 KV Contact /±15 KV Air

Discharge per the ESD test method specified in IEC 61000-4-2.

The device measures 3 mm x 3 mm and is intended to be

mounted directly onto an FR4 printed circuit board. The MLP

device meets typical thermal cycle and bend test specifications.

Electrical Characteristics

Symbol

Minimum

Nominal

Maximum

Unit

(T

A

= 25 °C unless otherwise noted)

Resistance

R

180

200

220

Ω

Capacitance @ 2.5 V 1 MHz

C

16

20

24

pF

Rated Standoff Voltage

V

WM

5.0

V

Breakdown Voltage @ 1 mA

V

BR

6.0

V

Forward Voltage @ 10 mA

V

F

0.8

V

Leakage Current @ 3 V

I

D

0.1

µA

ESD Protection: IEC 61000-4-2

Contact Discharge

±8

kV

Air Discharge

±15

kV

Thermal Characteristics

(T

A

= 25 °C unless otherwise noted)

DC Power Rating

P

100

mW

Operating Temperature Range

T

J

-40

25

+85

°C

Storage Temperature Range

T

STG

-55

25

+150

°C

Electrical & Thermal Characteristics

*RoHS Directive 2002/95/EC Jan 27 2003 including Annex