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HP1-TO66-8U Datasheet(PDF) 4 Page - CTS Corporation |
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HP1-TO66-8U Datasheet(HTML) 4 Page - CTS Corporation |
4 / 7 page HP1 Series for Three TO-66 Outline DESCRIPTION OF CURVES D. N.C. Horiz. Device Only Mounted to G-10. J. N.C. Horiz. & Vert. With Dissipator. K. 200 RPM w/Diss. L. 500 RPM w/Diss. E. 1000 RPM w/Diss. • Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound. • Derate 3.0 °C/watt per device for unplated part in natural convection only. • Case Temperatures Match Within 2 °C at equivalent power levels in natural convection. Ordering Information IERC PART NO. Unplated Comm’l. Black Anodize Mil. Black Anodize Semiconductor Accommodated Hole patt. Ref. No. (see pg. 1-30) Max. Weight (Grams) HP1-TO66-8U HP1-TO66-39U HP1-TO66-8CB HP1-TO66-39CB HP1-TO66-8B HP1-TO66-39B Two TO-66s Two TO-66 Ics 33 35 35.0 35.0 |
Similar Part No. - HP1-TO66-8U |
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Similar Description - HP1-TO66-8U |
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