ZXSDS2M832

SEMICO NDUC TORS

ISSUE 2 June 2003

2

PARAMETER

SYMBOL

VALUE

UNIT

Junction to Ambient

(a)(f)

R JA

83.3

°C/W

Junction to Ambient

(b)(f)

R JA

51

°C/W

Junction to Ambient

(c)(f)

R JA

125

°C/W

Junction to Ambient

(d)(f)

R JA

111

°C/W

Junction to Ambient

(d)(g)

R JA

73.5

°C/W

Junction to Ambient

(e)(g)

R JA

41.7

°C/W

NOTES

(a) For a dual device surface mounted on 8 sq. cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed pads attached. The

copper area is split down the center line into two separate areas with one half connected to each half of the dual device.

(b) Measured at t<5 secs for a dual device surface mounted on 8 sq cm single sided 2oz copper on FR4 PCB, in still air conditions with all exposed

pads attached. The copper area is split down the centerline into two separate areas with one half connected to each half of the dual device.

(c) For a dual device surface mounted on 8 sq cm single sided 2oz copper FR4 PCB, in still air conditions with minimal lead connections only.

(d) For a dual device surface mounted on 10 sq cm single sided 1oz copper FR4 PCB, in still air conditions with all exposed pads attached. The

copper area is split down the centerline into two separate areas with one half connected to each half of the dual device.

(e) For a dual device surface mounted on 85 sq cm single sided 2oz copper FR4 PCB, in still air conditions with all exposed pads attached. The

copper area is split down the centerline into two separate areas with one half connected to each half of the dual device.

(f) For dual device with one active die.

(g) For dual device with 2 active die running at equal power.

(h) Repetitive rating - pulse width limited by max junction temperature. Refer to Transient Thermal Impedance graph.

(i) The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device as shown in

the package dimensions data. The thermal resistance for a dual device mounted on 1.5mm thick FR4 board using minimum copper of 1 oz

weight, 1mm wide tracks and one half of the device active is Rth= 250°C/W giving a power rating of Ptot=400mW.

THERMAL RESISTANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Reverse Voltage

60

V

600

mV

Forward Current

1.65

A

Average Forward Current D=50%, t<=300us

1.24

A

Non Repetitive Forward Current t<=100us

Non Repetitive Forward Current t<=10ms

16.8

5.63

A

A

Linear Derating Factor

1.2

12

W

mW/°C

Linear Derating Factor

2

20

W

mW/°C

Linear Derating Factor

0.8

8

W

mW/°C

Linear Derating Factor

0.9

9

W

mW/°C

Linear Derating Factor

1.36

13.6

W

mW/°C

Linear Derating Factor

2.4

24

W

mW/°C

Storage Temp, Range

Tstg

-55 to+150

°C

Operating & Storage Temp, Range

Tj

-55 to+125

°C

ABSOLUTE MAXIMUM RATINGS