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S558-5999-75 Datasheet(PDF) 4 Page - Bel Fuse Inc. |
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S558-5999-75 Datasheet(HTML) 4 Page - Bel Fuse Inc. |
4 / 4 page defining a degree of excellence Corporate Office Bel Fuse Inc. 198 Van Vorst Street, Jersey City, NJ 07302-4496 Tel: 201-432-0463 Fax: 201-432-9542 E-Mail: BelFuse@belfuse.com Internet: http://www.belfuse.com Far East Office Bel Fuse Ltd. 8F/8 Luk Hop Street San Po Kong Kowloon, Hong Kong Tel: 852-2328-5515 Fax: 852-2352-3706 European Office Bel Fuse Europe Ltd. Preston Technology Management Centre Marsh Lane, Preston PR1 8UD Lancashire, U.K. Tel: 44-1772-556601 Fax: 44-1772-888366 APPLICATION NOTES • Bel has designed these part types for use in either 100 Mbps or 10/100 Mbps multi-port applications, where the PHY transceiver requires a list of recommended 1:1 transmit and receive isolation transformer ratios. Please refer to the Bel short form catalog for recommendations of mating semiconductors. These dual, 2-port devices provide high isolation transformers, signal wave shaping, fast but controlled rise times, EMI and common mode noise suppression. All part types meet IEEE 802.3 standards, which includes a requirement for 350µH OCL (inductance) at 8mA DC bias applied. Use of these Bel part types provides optimum space and cost per port efficiency with no sacrifice in performance versus similar single port devices. • Each dual, 2-port device is available with or without an impedance matching common mode termination. A balanced board layout and precise selection of discrete components used in conjunction with the termination is critical for proper functionality. For the background on how to correctly implement this termination, or for information on how to eliminate this circuit entirely, please review Bel's separate application note. • Bel's low profile, surface mount packaging is ideal for high speed pick and place machinery. Parts can be shipped on tape and reel for high speed placement. Construction processes have been implemented for thermal compatibility with high temperature IR reflow assembly processing. Post dipping of leads assist with PC board solderability. Each part is optically inspected to meet rigid coplanarity requirements. 960010A HIGHSPEEDLANMAGNETICS |
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Similar Description - S558-5999-75 |
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