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MF-MSMF160 Datasheet(PDF) 1 Page - Bourns Electronic Solutions |
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MF-MSMF160 Datasheet(HTML) 1 Page - Bourns Electronic Solutions |
1 / 5 page * RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Electrical Characteristics Max. Time Tripped Ihold Itrip To Trip Power Resistance Dissipation Model Amperes Ohms Amperes Seconds Watts V max. I max. at 23 °C at 23 °C at 23 °C at 23 °C at 23 °C Volts Amps Hold Trip RMin. R1Max. Typ. MF-MSMF010 60.0 40 0.10 0.30 0.70 15.00 0.5 1.50 0.8 MF-MSMF014 60.0 40 0.14 0.34 0.40 6.50 1.5 0.15 0.8 MF-MSMF020 30.0 80 0.20 0.40 0.40 6.00 6.0 0.06 0.8 MF-MSMF030 30.0 10 0.30 0.60 0.30 3.00 8.0 0.10 0.8 MF-MSMF050 15.0 100 0.50 1.00 0.15 1.00 8.0 0.15 0.8 MF-MSMF075 13.2 100 0.75 1.50 0.11 0.45 8.0 0.20 0.8 MF-MSMF075/24 24.0 40 0.75 1.50 0.11 0.45 8.0 0.20 0.8 MF-MSMF110 6.0 100 1.10 2.20 0.04 0.21 8.0 0.30 0.8 MF-MSMF110/16 16.0 100 1.10 2.20 0.04 0.21 8.0 0.30 0.8 MF-MSMF125 6.0 100 1.25 2.50 0.035 0.14 8.0 0.40 0.8 MF-MSMF150 6.0 100 1.50 3.00 0.03 0.120 8.0 0.5 0.8 MF-MSMF160 8.0 100 1.60 2.80 0.035 0.099 8.0 2.0 0.8 MF-MSMF200 8.0 40 2.00 4.00 0.020 0.080 8.0 3.0 0.8 MF-MSMF250/16 16.0 100 2.50 5.00 0.015 0.100 8.0 5.0 0.8 MF-MSMF260 6.0 100 2.60 5.20 0.015 0.080 8.0 5.0 0.8 Operating Temperature ......................................-40 °C to +85 °C Maximum Device Surface Temperature in Tripped State ................................................125 °C Passive Aging......................................................+85 °C, 1000 hours ....................................±5 % typical resistance change Humidity Aging....................................................+85 °C, 85 % R.H. 1000 hours ..................±5 % typical resistance change Thermal Shock ....................................................+85 °C to -40 °C, 20 times ........................±10 % typical resistance change Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change Vibration ..............................................................MIL-STD-883C, Method 2007.1, ................No change Condition A Environmental Characteristics Test Test Conditions Accept/Reject Criteria Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description Resistance ......................................In still air @ 23 °C............................................................Rmin ≤ R ≤ R1max Time to Trip ....................................At specified current, Vmax, 23 °C ..................................T ≤ max. time to trip (seconds) Hold Current ..................................30 min. at Ihold ..............................................................No trip Trip Cycle Life ................................Vmax, Imax, 100 cycles ..................................................No arcing or burning Trip Endurance ................................Vmax, 48 hours ..............................................................No arcing or burning Solderability ....................................ANSI/J-STD-002 ............................................................95 % min. coverage UL File Number ..................................E174545 http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545 CSA File Number ................................CA110338 http://directories.csa-international.org/ Under “Certification Record” and “File Number” enter 110338-0-000 (Model MF-MSMF110 is CSA approved) TÜV Certificate Number......................R 02057213 http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213 (Model MF-MSMF110 is TÜV approved) Test Procedures And Requirements For Model MF-MSMF Series MF-MSMF Series - PTC Resettable Fuses Features ■ 100 % electrically compatible with all previous generations of 1812 SMT devices ■ Compatible with Pb and Pb-free solder reflow profiles ■ Surface mount packaging for automated assembly ■ RoHS compliant* ■ Agency recognition: Applications High Density Circuit Board Applications: ■ Hard disk drives ■ PC motherboards ■ PC peripherals ■ Point-of-sale (POS) equipment ■ PCMCIA cards ■ USB ports TV Rheinland |
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