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LP38859T-0.8 Datasheet(PDF) 4 Page - National Semiconductor (TI) |
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LP38859T-0.8 Datasheet(HTML) 4 Page - National Semiconductor (TI) |
4 / 14 page Electrical Characteristics Unless otherwise specified: V IN =VOUT(NOM) + 1V, VBIAS = 3.0V, IOUT =10mA, CIN =COUT = 10 µF, CBIAS = 1 µF, CSS = open. Limits in standard type are for TJ = 25˚C only; limits in boldface type apply over the junction temperature (T J) range of -40˚C to +125˚C. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at T J = 25˚C, and are provided for reference purposes only. (Continued) Symbol Parameter Conditions MIN TYP MAX Units AC Parameters PSRR (V IN) Ripple Rejection for V IN Input Voltage V IN =VOUT(NOM) + 1V, f = 120 Hz -80- dB V IN =VOUT(NOM) + 1V, f=1kHz -65- PSRR (V BIAS) Ripple Rejection for V BIAS Voltage V BIAS =VOUT(NOM) + 3V, f = 120 Hz -58- V BIAS =VOUT(NOM) + 3V, f=1kHz -58- e n Output Noise Density f = 120 Hz - 1 - µV/ √Hz Output Noise Voltage V OUT = 1.8V BW = 10 Hz − 100 kHz - 150 - µV (rms) BW = 300 Hz − 300 kHz - 90 - Thermal Parameters T SD Thermal Shutdown Junction Temperature - 160 - ˚C T SD(HYS) Thermal Shutdown Hysteresis - 10 - θ J-A Thermal Resistance, Junction to Ambient(Note 3) TO220-5 - 60 - ˚C/W TO263-5 - 60 - θ J-C Thermal Resistance, Junction to Case(Note 3) TO220-5 - 3 - TO263-5 - 3 - Note 1: Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but does not guarantee specific performance limits. For guaranteed specifications and conditions, see the Electrical Characteristics. Note 2: The human body model is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Test method is per JESD22-A114. The HBM rating for device pin 1 (SS) is ±1.5 kV. Note 3: Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to ambient thermal resistance ( θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not exceed the maximum operating rating. See the Application Information section for details. Note 4: Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage. Note 5: Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from no load to full load. Note 6: Dropout voltage is defined the as input to output voltage differential (VIN -VOUT) where the input voltage is low enough to cause the output voltage to drop no more than 2% from the nominal value. www.national.com 4 |
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