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MAX2027 Datasheet(PDF) 8 Page - Maxim Integrated Products |
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MAX2027 Datasheet(HTML) 8 Page - Maxim Integrated Products |
8 / 10 page IF Digitally Controlled Variable-Gain Amplifier 8 _______________________________________________________________________________________ Fixed-Gain Amplifier The MAX2027 integrates a fixed-gain amplifier in a neg- ative feedback topology. This fixed-gain amplifier is optimized for a frequency range of operation from 50MHz to 400MHz with a high-output third-order inter- cept point (OIP3). The bias current is chosen to opti- mize the IP3 of the amplifier. When R1 is 825Ω, the current consumption is 60mA while exhibiting a typical 35dBm output IP3. Choke Inductor The fixed-gain amplifier output port requires an external pullup choke inductor to VCC. At the input, connect a bias inductor of 330nH from AMPIN (pin 15) to IBIAS (pin 14). At the output, connect a 680nH choke inductor from RF_OUT (pin 12) to VCC (pin 11) to provide bias current to the amplifier. Layout Considerations A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and induc- tance. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PC board exposed pad must be connected to the ground plane of the PC board. It is suggested that multi- ple vias be used to connect this pad to the lower level ground planes. This method provides a good RF/thermal conduction path for the device. Solder the exposed pad on the bottom of the device package to the PC board. The MAX2027 Evaluation Kit can be used as a refer- ence for board layout. Gerber files are available upon request at www.maxim-ic.com. Power-Supply Bypassing Proper voltage-supply bypassing is essential for high- frequency circuit stability. Bypass each VCC pin with a 0.1µF and 100pF capacitor. Connect the 100pF capacitor as close to VCC pins as possible. Exposed Pad RF/Thermal Considerations The exposed paddle (EP) of the MAX2027’s 20-pin TSSOP-EP package provides a low thermal-resistance path to the die. It is important that the PC board on 20 19 18 17 16 15 14 13 1 2 3 4 5 6 7 8 RF IN VCC C2 R2 R3 B2 B3 B4 12 11 9 10 RF OUT VCC B0 B1 MAX2027 ATTENUATION LOGIC CONTROL AMP BIAS VCC C8* L3* C7 C6 C5 L2 L1 C1 R4 R5 R6 CONTROL INPUTS L4* ATTNOUT AMPIN *OPTIONAL COMPONENTS: USE TO IMPROVE HIGHER FREQUENCY MATCHING IBIAS ISET C3 C9* C10 C4 R1 EXPOSED PADDLE Figure 1. Typical Application Circuit |
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Similar Description - MAX2027 |
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