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WV3EG232M64STSU335D4SG Datasheet(PDF) 8 Page - White Electronic Designs Corporation |
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WV3EG232M64STSU335D4SG Datasheet(HTML) 8 Page - White Electronic Designs Corporation |
8 / 14 page 8 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WV3EG232M64STSU-D4 September 2005 Rev. 1 PRELIMINARY White Electronic Designs Corp. reserves the right to change products or specifications without notice. IDD SPECIFICATIONS AND TEST CONDITIONS 0°C ≤ TA ≤ 70°C, VCCQ = 2.5V ±0.2V, VCC = 2.5V ±0.2V Parameter Symbol Conditions DDR333 @ CL = 2.5 Max Unit Operating current - One bank Active- Precharge IDD0* tRC = tRC(min); tCK = 100Mhz for DDR200, 133Mhz for DDR266A & DDR266B; DQ,DM and DQS inputs changing twice per clock cycle; address and control inputs changing once per clock cycle 404 mA Operating current - One bank operation IDD1* One bank open, BL=4, Reads - Refer to the following page for detailed test condition 416 mA Percharge power- down standby current IDD2P** All banks idle; power - down mode; CKE = <VIL(max); tCK = 100Mhz for DDR200, 133Mhz for DDR266A & DDR266B; Vin = Vref for DQ,DQS and DM 40 mA Precharge Floating standby current IDD2F** CS# > = VIH(min);All banks idle; CKE > = VIH(min); tCK = 100Mhz for DDR200, 133Mhz for DDR266A & DDR266B; Address and other control inputs changing once per clock cycle; VIN = VREF for DQ,DQS and DM 200 mA Active power - down standby current IDD3P** one bank active; power-down mode; CKE=< VIL (max); tCK = 100Mhz for DDR200, 133Mhz for DDR266A & DDR266B; VIN = VREF for DQ, DQS and DM 88 mA Active standby current IDD3N** CS# > = VIH(min); CKE> = VIH(min); one bank active; active - precharge; tRC = tRASmax; tCK = 100Mhz for DDR200, 133Mhz for DDR266A & DDR266B; DQ, DQS and DM inputs changing twice per clock cycle; address and other control inputs changing once per clock cycle 360 mA Operating current - burst read IDD4R* Burst length = 2; reads; continguous burst; One bank active; address and control inputs changing once per clock cycle; CL = 2 at tCK = 100Mhz for DDR200, CL = 2 at tCK = 133Mhz for DDR266A, CL = 2.5 at tCK = 133Mhz for DDR266B ; 50% of data changing at every burst; lout = 0mA 436 mA Operating current - burst write IDD4W* Burst length = 2; writes; continuous burst; One bank active address and control inputs changing once per clock cycle; CL = 2 at tCK = 100Mhz for DDR200, CL = 2 at tCK = 133Mhz for DDR266A, CL = 2.5 at tCK = 133Mhz for DDR266B ; DQ, DM and DQS inputs changing twice per clock cycle, 50% of input data changing at every burst 488 mA Auto refresh current IDD5** tRC = tRFC(min) - 8*tCK for DDR200 at 100Mhz, 10*tCK for DDR266A & DDR266B at 133Mhz; distributed refresh 1544 mA Self refresh current; CKE =< 0.2V IDD6** External clock should be on; tCK = 100Mhz for DDR200, 133Mhz for DDR266A & DDR266B 40 mA Orerating current - Four bank operation IDD7A* Four bank interleaving with BL=4 -Refer to the following page for detailed test condition 1248 mA NOTE: IDD specification is based on NANYA components. Other DRAM Manufacturers specification may be different. * Value calculated as one module rank in this operation condition and other module rank in IDD2P (CKE low) mode. ** Value calculated as all module ranks in this operation condition. |
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