WS1M32V-XG3X

1

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

White Electronic Designs

White Electronic Designs Corp. reserves the right to change products or specifications without notice.

February, 2001

Rev. 5

PRELIMINARY*

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GND

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1Mx32 SRAM 3.3V MODULE

FEATURES

Access Times of 17, 20, 25ns

84 lead, 28mm CQFP, (Package 511)

Organized as two banks of 512Kx32, User

Configurable as 2Mx16 or 4Mx8

Commercial, Industrial and Military Temperature

Ranges

TTL Compatible Inputs and Outputs

PIN CONFIGURATION FOR WS1M32V-XG3X

PIN DESCRIPTION

I/O0-31

Data Inputs/Outputs

A0-18

Address Inputs

WE#1-4

Write Enables

CS#1-2

Chip Selects

OE#1-4

Output Enables

+3.3V Power Supply

GND

Ground

NC

Not Connected

TOP VIEW

3.3V Power Supply

Low Power CMOS

Built-in Decoupling Caps and Multiple Ground Pins

for Low Noise Operation

Weight - WS1M32V-XG3X - 20 grams typical

*This product is under development, is not qualified or characterized and is subject to

change without notice.

BLOCK DIAGRAM

8

I/O0-7

CS#1

I/O8-15

CS#2

I/O16-23

I/O24-31

A0-18

WE#1

8

2M x 8

8

512K x 8

8

512K x 8

2M x 8

512K x 8

512K x 8

2M x 8

512K x 8

512K x 8

2M x 8

512K x 8

512K x 8

OE#1

WE#2

OE#2

WE#3

OE#3

WE#4

OE#4

Note: CS#1& CS#2 are used as bank select

The WEDC 84 lead G3 CQFP fills the same fit and function as the JEDEC 84 lead

CQFJ or 84 PLCC. But the G3 has the TCE and lead inspection advantage of the

CQFP form.

1.146"