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WEDPZ512K72V-133BI Datasheet(PDF) 5 Page - White Electronic Designs Corporation |
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WEDPZ512K72V-133BI Datasheet(HTML) 5 Page - White Electronic Designs Corporation |
5 / 14 page 5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs WEDPZ512K72V-XBX February 2006 Rev. 7 DC CHARACTERISTICS -55°C ≤ TA ≤ + 125°C Description Symbol Conditions 150 MHz (Max) 133 MHz (Max) 100 MHz (Max) Units Notes Power Supply Current: Operating IDD Device Selected; All Inputs ≤ VIL or ≥ VIH; Cycle Time ≥ TCYC MIN; VCC = MAX; Output Open 700 650 600 mA 1 Power Supply Current: Standby ISB2 Device Deselected; VCC = MAX; All Inputs ≤ VIL or ≥ VIH All Inputs Static; CLK Frequency = MAX Output Open, ZZ ≥ VCC - 0.2V 120 120 120 mA Clock Running Standby Current ISB Device Deselected; VCC = MAX; All Inputs ≤ VSS + 0.2 or ≥ VCC - 0.2; f = max ; ZZ ≤ VIL 200 180 160 mA NOTES: 1. IDD is specified with no output current and increases with faster cycle times. IDD increases with faster cycle times and greater output loading. ABSOLUTE MAXIMUM RATINGS* Electrical Characteristics -55°C ≤ TA ≤ + 125°C Description Symbol Conditions Min Max Units Notes Input High (Logic 1) Voltage VIH 3.3V I/O 2.0 VCC +0.5 V 1 2.5V I/O 1.7 VCC +0.5 Input Low (Logic 0) Voltage VIL 3.3V I/O -0.3 0.7 V 1 2.5 I/O -0.3 0.7 Input Leakage Current IIL VCC = Max, 0V ≤ VIN ≤ VCC -4 +4 µA 2 Output Leakage Current IOL Output(s) Disabled, VOUT = VSS to VCCQ -2 +2 µA Output High Voltage VOH IOH = -4.0mA 2.4 — V 1 IOH = -1mA (2.5v I/O) 2.0 — V Output Low Voltage VOL IOL = 8.0mA (3.3V I/O) — 0.4 V 1 IOL = 1.0 mA (2.5v I/O) — 0.4 V Supply Voltage VCC 3.135 3.465 V 1 I/O Power Supply (3.3V) VCCQ 3.135 3.465 V 1 I/O Power Supply (2.5V) VCCQ 2.375 2.9 V 1 NOTES: 1. All voltages referenced to VSS (GND) 2. ZZ pin has an internal pull-up, and input leakage = ± 20 µA. BGA CAPACITANCE TA = + 25°C, f = 1MHz Description Symbol Max Units Notes Control Input Capacitance (LBO#, zz) CIC 16 pF 1 Control Input Capacitance CI 8 pF 1 Input/Output Capacitance (DQ) CO 10 pF 1 Address Capacitance CA 16 pF 1 Clock Capacitance CCK 6 pF 1 NOTES: 1. This parameter is not tested but guaranteed by design. THERMAL RESISTANCE Parameter Symbol Max Unit Thermal Resistance: Die Junction to Ambient θJA 28.1 °C/W Thermal Resistance: Die Junction to Ball θJB 16.0 °C/W Thermal Resistance: Die Junction to Case θJC 7.1 °C/W Note: Refer to Application Note “PBGA Thermal Resistance Corrleation” for further information regarding WEDC’s thermal modeling. VIN Voltage or any other pin relative hovss -0.3V to +4.6V Voltage on VCC Supply Relative to VSS -0.3V to +4.6V Storage Temperature (BGA) -55°C to +150°C Maximum Operating Junction Temperature 125°C * Stress greater than those listed under “Absolute Maximum Ratings: may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. |
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