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White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

White Electronic Designs

WEDPZ512K72V-XBX

February 2006

Rev. 7

DC CHARACTERISTICS

Description

Symbol

Conditions

150

MHz

(Max)

133

MHz

(Max)

100

MHz

(Max)

Units

Notes

Power Supply Current:

Operating

700

650

600

mA

1

Power Supply Current:

Standby

All Inputs Static; CLK Frequency = MAX

120

120

120

mA

Clock Running Standby

Current

200

180

160

mA

NOTES:

1.

ABSOLUTE MAXIMUM RATINGS*

Electrical Characteristics

Description

Symbol

Conditions

Min

Max

Units

Notes

Input High (Logic 1) Voltage

3.3V I/O

2.0

V

1

2.5V I/O

1.7

Input Low (Logic 0) Voltage

3.3V I/O

-0.3

0.7

V

1

2.5 I/O

-0.3

0.7

Input Leakage Current

-4

+4

µA

2

Output Leakage Current

-2

+2

µA

Output High Voltage

2.4

—

V

1

2.0

—

V

Output Low Voltage

—

0.4

V

1

—

0.4

V

Supply Voltage

3.135

3.465

V

1

I/O Power Supply (3.3V)

3.135

3.465

V

1

I/O Power Supply (2.5V)

2.375

2.9

V

1

NOTES:

1.

2.

ZZ pin has an internal pull-up, and input leakage = ± 20 µA.

BGA CAPACITANCE

Description

Symbol

Max

Units

Notes

Control Input Capacitance (LBO#, zz)

16

pF

1

Control Input Capacitance

CI

8

pF

1

Input/Output Capacitance (DQ)

CO

10

pF

1

Address Capacitance

CA

16

pF

1

Clock Capacitance

CCK

6

pF

1

NOTES: 1. This parameter is not tested but guaranteed by design.

THERMAL RESISTANCE

Parameter

Symbol

Max

Unit

Thermal Resistance: Die Junction to Ambient

θJA

28.1

°C/W

Thermal Resistance: Die Junction to Ball

θJB

16.0

°C/W

Thermal Resistance: Die Junction to Case

θJC

7.1

°C/W

Note: Refer to Application Note “PBGA Thermal Resistance Corrleation” for further

information regarding WEDC’s thermal modeling.

-0.3V to +4.6V

-0.3V to +4.6V

Storage Temperature (BGA)

-55°C to +150°C

Maximum Operating Junction Temperature

125°C

* Stress greater than those listed under “Absolute Maximum Ratings: may cause

permanent damage to the device. This is a stress rating only and functional operation

of the device at these or any other conditions greater than those indicated in the

operational sections of this specification is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect reliability.