WEDPS512K32-XBX

2

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

White Electronic Designs

White Electronic Designs Corp. reserves the right to change products or specifications without notice.

November, 2003

Rev.6

Parameter

Symbol

Min

Max

Unit

Operating Temperature

-55

+125

°C

Storage Temperature

-65

+150

°C

Signal Voltage Relative to GND

-0.5

V

Junction Temperature

150

°C

Supply Voltage

-0.5

7.0

V

TRUTH TABLE

RECOMMENDED OPERATING CONDITIONS

ABSOLUTE MAXIMUM RATINGS

Parameter

Symbol

Min

Max

Unit

Supply Voltage

4.5

5.5

V

Input High Voltage

2.2

V

Input Low Voltage

-0.5

+0.8

V

Operating Temp (Mil)

-55

+125

°C

CAPACITANCE

Parameter

Symbol

Conditions

Max

Unit

OE# capacitance

30

pF

WE#1-4 capacitance

10

pF

CS#1-4 capacitance

10

pF

Data I/O capacitance

10

pF

Address input capacitance

30

pF

Parameter

Symbol

Conditions

Min

Max

Units

Input Leakage Current

10

µA

Output Leakage Current

10

µA

Operating Supply Current x 32 Mode

660

mA

Standby Current

80

mA

Output Low Voltage

0.4

V

Output High Voltage

2.4

V

DC CHARACTERISTICS

CS

OE

WE

Mode

Data I/O

Power

H

X

X

Standby

High Z

Standby

L

L

H

Read

Data Out

Active

L

H

H

Out Disable

High Z

Active

L

X

L

Write

Data In

Active

This parameter is guaranteed by design but not tested.

BGA THERMAL RESISTANCE

Description

Symbol

Max

Unit

Notes

Junction to Ambient (No Airflow)

Theta JA

16.5

1

Junction to Ball

Theta JB

11.3

1

Junction to Case (Top)

Theta JC

9.8

1

NOTE: Refer to Application Note "PBGA Thermal Resistance Correlation" at www.

whiteedc.com in the application notes section for modeling conditions.