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HCPL-553X Datasheet(PDF) 2 Page - Agilent(Hewlett-Packard)

Part No. HCPL-553X
Description  Hermetically Sealed, Transistor Output Optocouplers for Analog and Digital Applications
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Maker  HP [Agilent(Hewlett-Packard)]
Homepage  http://www.home.agilent.com
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 2 page
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2
Truth Table
(Positive Logic)
Functional Diagram
Multiple Channel Devices
Available
Input
Output
On (H)
L
Off (L)
H
V CC
GND
V O
V B
Each channel contains a
GaAsP light emitting diode
which is optically coupled to
an integrated photon detector.
Separate connections for the
photodiodes and output
transistor collectors improve
the speed up to a hundred
times that of a conventional
phototransistor optocoupler by
reducing the base-collector
capacitance.
These devices are suitable for
wide bandwidth analog
applications, as well as for
interfacing TTL to LSTTL or
CMOS. Current Transfer Ratio
(CTR) is 9% minimum at IF =
16 mA. The 18 V VCC
capability will enable the
designer to interface any TTL
family to CMOS. The
availability of the base lead
allows optimized gain/
bandwidth adjustment in
analog applications. The
shallow depth of the IC
photodiode provides better
radiation immunity than
conventional phototransistor
couplers.
These products are also
available with the transistor
base node not connected to
improve common mode noise
immunity and ESD
susceptibility. In addition,
higher CTR minimums are
available by special request.
Package styles for these parts
are 8 and 16 pin DIP through
hole (case outlines P and E
respectively), 16 pin DIP flat
pack (case outline F), and
leadless ceramic chip carrier
(case outline 2). Devices may
be purchased with a variety of
lead bend and plating options,
see Selection Guide Table for
details. Standard Microcircuit
Drawing (SMD) parts are
available for each package and
lead style.
Because the same functional
die (emitters and detectors)
are used for each channel of
each device listed in this data
sheet, absolute maximum
ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are identical for all
parts. Occasional exceptions
exist due to package variations
and limitations and are as
noted. Additionally, the same
package assembly processes
and materials are used in all
devices. These similarities give
justification for the use of data
obtained from one part to
represent other part’s
performance for die related
reliability and certain limited
radiation test results.




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