W3EG7262S-D3

-JD3

11

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

White Electronic Designs

May 2005

Rev. 3

PRELIMINARY

133.48

(5.255" MAX.)

3.99

(0.157 (2x))

17.78

(0.700)

10.01

(0.394)

6.35

(0.250)

64.77

(2.550)

1.78

(0.070)

49.53

(1.950)

3.00

(0.118)

(4x)

30.48

(1.20)

MAX

2.31

(0.091)

(2x)

1.27

(0.050 TYP.)

6.35

(0.250)

128.95

(5.077")

131.34

(5.171")

3.81

(0.150) MAX

3.99

(0.157)

(MIN)

1.27 ± 0.10

(0.050 ± 0.004)

PACKAGE DIMENSIONS FOR D3

* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES)

ORDERING INFORMATION FOR D3

Part Number

Speed

CAS Latency

Height*

W3EG7262S262D3

133MHz/266Mb/s

2

2

2

30.48 (1.20")

W3EG7262S265D3

133MHz/266Mb/s

2.5

3

3

30.48 (1.20")

W3EG7262S202D3

100MHz/200Mb/s

2

2

2

30.48 (1.20")

NOTES:

• Consult Factory for availability of RoHS compliant products. (G = RoHS Compliant)

• Vendor specific part numbers are used to provide memory components source control. The place holder for this is shown as lower case “x” in the part numbers above and is to

be replaced with the respective vendors code. Consult factory for qualified sourcing options. (M = Micron, S = Samsung & consult factory for others)

• Consult factory for availability of industrial temperature (-40°C to 85°C) option