Electronic Components Datasheet Search |
|
W3E16M72S-XBX Datasheet(PDF) 1 Page - White Electronic Designs Corporation |
|
W3E16M72S-XBX Datasheet(HTML) 1 Page - White Electronic Designs Corporation |
1 / 17 page 1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs W3E16M72S-XBX February 2005 Rev. 7 GENERAL DESCRIPTION The 128MByte (1Gb) DDR SDRAM is a high-speed CMOS, dynamic random-access, memory using 5 chips containing 268,435,456 bits. Each chip is internally configured as a quad-bank DRAM. Each of the chip’s 67,108,864-bit banks is organized as 8,192 rows by 512 columns by 16 bits. The 128 MB DDR SDRAM uses a double data rate architecture to achieve high-speed operation. The double data rate architecture is essentially a 2n-prefetch architecture with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write access for the 128MB DDR SDRAM effectively consists of a single 2n-bit wide, one-clock-cycle data tansfer at the internal DRAM core and two corresponding n-bit wide, one-half-clock-cycle data transfers at the I/O pins. A bidirectional data strobe (DQS) is transmitted externally, 16Mx72 DDR SDRAM FEATURES DDR SDRAM Rate = 200, 250, 266 Package: • 219 Plastic Ball Grid Array (PBGA), 32 x 25mm 2.5V ±0.2V core power supply 2.5V I/O (SSTL_2 compatible) Differential clock inputs (CLK and CLK#) Commands entered on each positive CLK edge Internal pipelined double-data-rate (DDR) architecture; two data accesses per clock cycle Programmable Burst length: 2,4 or 8 Bidirectional data strobe (DQS) transmitted/received with data, i.e., source-synchronous data capture (one per byte) DQS edge-aligned with data for READs; center- aligned with data for WRITEs DLL to align DQ and DQS transitions with CLK Four internal banks for concurrent operation Two data mask (DM) pins for masking write data Programmable IOL/IOH option Auto precharge option Auto Refresh and Self Refresh Modes Commercial, Industrial and Military Temperature Ranges Organized as 16M x 72 Weight: W3E16M72S-XBX – 3.55 grams typical * This product is subject to change without notice.. BENEFITS 40% SPACE SAVINGS Reduced part count Reduced I/O count • 34% I/O Reduction Reduced trace lengths for lower parasitic capacitance Suitable for hi-reliability applications Laminate interposer for optimum TCE match Upgradeable to 32M x 72 density (W3E32M72S-XBX) 25 32 66 TSOP 66 TSOP 66 TSOP 66 TSOP 11.9 11.9 11.9 11.9 11.9 22.3 Monolithic Solution Actual Size W3E16M72S-XBX S A V I N G S Area I/O Count 5 x 265mm2 = 1328mm2 5 x 66 pins = 330 pins 800mm2 40% 219 Balls 34% W3E16M72S-XBX White Electronic Designs |
Similar Part No. - W3E16M72S-XBX |
|
Similar Description - W3E16M72S-XBX |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |