Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©2005 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

Page 3 of 7

Mechanical Drawing

Bias Arrangement

Bypass Capacitors

- See App Note [2]

(Note: Engineering designator is 40TX0531)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.013 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All DC/IF Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.987 mg.

Bond Pad #1 (RF Out)

Bond Pad #2 (Vd1)

Bond Pad #3 (IF1)

Bond Pad #4 (Vd2)

Bond Pad #5 (LO)

Bond Pad #6 (Vg4)

Bond Pad #7 (Vg2)

Bond Pad #8 (Vg3)

Bond Pad #7 (IF2)

Bond Pad #8 (Vg1)

May 2005 - Rev 20-May-05

32.0-45.0 GHz GaAs MMIC

Transmitter

U1004

1

2

3

4

5

6

7

8

0.295

(0.080)

1.620

(0.041)

0.921

(0.234)

1.621

(0.041)

2.220

(0.056)

3.970

(0.101)

0.646

(0.016)

2.821

(0.072)

2.421

(0.062)

2.021

(0.051)

9

10

1.621

(0.041)

0.921

(0.023)

0.0

0.0

1

2

3

4

5

6

7

8

9

10

Vg1

Vg3

Vg4

Vg2

IF2

LO

Vd2

IF1

Vd1

RF

Vd1

Vd2

IF1

Vg4

LO

IF2

Vg2

Vg3

Vg1

RF