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Mechanical Drawing

Bias Arrangement

Bypass Capacitors - See App Note [2]

(Note: Engineering designator is 30KRP_03A)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 4.152 mg.

Bond Pad #1 (Vg1)

Bond Pad #2 (RF)

Bond Pad #3 (Vd1)

Bond Pad #4 (Vd2)

Bond Pad #5 (IF1)

Bond Pad #6 (Vg4)

Bond Pad #9 (Vg3)

Bond Pad #10 (Vg2)

Bond Pad #7 (LO)

Bond Pad #8 (IF2)

Vd1,2

Vg4

IF1

LO

IF2

Vg3

Vg1,2

RF

R1002

1

2

3

4

5

6

7

8

9

10

0.399

(0.016)

0.0

1.397

(0.055)

2.000

(0.079)

0.897

(0.035)

1.496

(0.059)

1.895

(0.075)

1.600

(0.063)

1.000

(0.039)

3.350

(0.132)

1.895

(0.075)

1.496

(0.059)

0.897

(0.035)

0.0

R1002

Vg1,2

Vg3

IF2

LO

Vg4

IF1

Vd1,2

RF

1

2

3

5

6

7

9

10

8

4

18.0-34.0 GHz GaAs MMIC

Receiver

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©2006 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

May 2006 - Rev 21-May-06

R1002