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EM6503P02 Datasheet(PDF) 10 Page - EM Microelectronic - MARIN SA |
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EM6503P02 Datasheet(HTML) 10 Page - EM Microelectronic - MARIN SA |
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10 / 28 page  EM65XX Copyright © 2005, EM Microelectronic-Marin SA 10 www.emmicroelectronic.com Todays Versions I/O’s VLD levels Remarks EM6504P02 As defined As defined - Die, pad location and size Package SO24 package. See dimensions in section 10. Y=−208 All dimensions in Microns Qin Y=163 Y=939 QOut Y=1311 RESET Y=2938 VSS Y=3343 TEST Y=4030 Vss Y=290 Y=4237 Y=108 PB0 Y=1031 Y=871 PB1 Y=1792 Y=1632 PB2 Y=2841 Y=2681 PB3 Y=3602 Y=3442 Y=0 Y=3686 BUZZER Y=0 heith of the die Z = 11 mils or X = 195 mils by Y = 175 mils EM6504 CHIP SIZE is X = 4953 microns by Y = 4445 microns |
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