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AMMP-5618-TR2 Datasheet(PDF) 7 Page - Agilent(Hewlett-Packard) |
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AMMP-5618-TR2 Datasheet(HTML) 7 Page - Agilent(Hewlett-Packard) |
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7 / 9 page  7 Recommended SMT Attachment The AMMP Packaged Devices are compatible with high volume surface mount PCB assembly processes. The PCB material and mounting pattern, as defined in the data sheet, optimizes RF performance and is strongly recommended. An electronic drawing of the land pattern is available upon request from Agilent Sales & Application Engineering. Manual Assembly 1. Follow ESD precautions while handling packages. 2. Handling should be along the edges with tweezers. 3. Recommended attachment is conductive solder paste. Please see recommended solder reflow profile. Conduc- tive epoxy is not recom- mended. Hand soldering is not recommended. 4. Apply solder paste using a stencil printer or dot place- ment. The volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical and electrical performance. 5. Follow solder paste and vendor’s recommendations when developing a solder reflow profile. A standard profile will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. 6. Packages have been qualified to withstand a peak tempera- ture of 260 °C for 20 seconds. Verify that the profile will not expose device beyond these limits. Dimensional Tolerances: 0.002" [0.05 mm] 12 3 76 5 32 1 56 7 .200 [5.08] .200 [5.08] 84 .075 [1.91] .114 [2.9] .014 [0.365] .016 [0.40] .012 [0.30] .028 [0.70] .093 [2.36] .016 [0.40] .100 [2.54] .011 [0.28] .018 [0.46] .126 [3.2] .059 [1.5] .100 [2.54] .029 [0.75] 4 8 Front View Side View Back View Notes: 1. * Indicates Pin 1 2. Dimensions are in inches [millimeters] 3. All Grounds must be soldered to PCB RF Ground .093 [2.36] .010 [0.25] .011 [0.28] .126 [3.20] .059 [1.50] .020 [0.50] .018 [0.46] .018 [0.46] .114 [2.90] .0095 [0.24] .012 [0.3] .016 [0.40] .0095 [0.24] .016 [0.40] Figure 23. Suggested PCB Material and Land Pattern. Figure 22. Outline Drawing. |
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