3
www.johansontechnology.com
DIELECTRIC CHARACTERISTICS
0.8
1.0
10.0
1
10
100
200
Capacitance (pF)
R07/0402
R14/0603
R15/0805
Typical Series Resonant Frequency
MECHANICAL & ENVIRONMENTAL CHARACTERISTICS
SPECIFICATION
TEST PARAMETERS
SOLDERABILITY:
Solder coverage
≥ 90% of
Preheat chip to 120°-150°C for 60 sec.
metalized areas
Dip terminals in rosin flux then dip in
62Sn/36Pb/2Ag solder @ 240±5°C
Dip time = 5±1 sec.
RESISTANCE TO
Chip should not crack.
Preheat chip to 120°-150°C for 60 sec.
SOLDERING HEAT:
Solder coverage
≥ 80%
Dip terminals in rosin flux then dip in
62Sn/36Pb/2Ag solder @ 260±5°C
Dip time = 10±1 sec.
TERMINAL
Termination should not pull off.
Linear pull force exerted on axial leads soldered
ADHESION:
Ceramic should remain undamaged.
to each terminal. Terminal strength: For 0402:
≥2.0Lbs For 0603: ≥2.0Lbs For 0805:≥5.0Lbs
PCB DEFLECTION:
No mechanical damage.
Glass Epoxy PCB: 1 mm deflection
Cap. change: 2% or .5pF Max
LIFE TEST:
Cap. change: 2% or .5pF Max
1000 Hours, 125°C, 200% rated voltage
I.R. = Initial value
THERMAL SHOCK:
Cap. change: 2% or .5pF Max
5 CYCLES: 30±3 minutes @ -55°C, 3 min.@25°C
I.R. = 70% of initial value
30±3 min. @ +125°C, 3 min. @ 25°C
MOISTURE
Cap. change: 2% or .5pF Max
240 Hours, 85% Relative Humidity, 85°C, 1.5 VDC
RESISTANCE:
I.R. = 70% of initial value
TEMPERATURE COEFFICIENT:
0 ± 30ppm /°C, -55 to 125°C
QUALITY FACTOR:
2,500 min.,10,000 typical
INSULATION RESISTANCE:
>1,000 G
Ω @ 25°C,WVDC;
125°C IR is 10% of 25°C rating.
DIELECTRIC STRENGTH:
2.5 X WVDC Min., 25°C, 50 mA max
TEST PARAMETERS:
1MHz ±50kHz, 1.0±0.2 VRMS, 25°C
AVAILABLE CAPACITANCE:
Size 0402:
0.2 - 15 pF
Size 0603:
0.2 - 47 pF
Size 0805:
0.2 - 150 pF
Size 1210:
0.5 - 1000 pF
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