PACKAGING INFORMATION

Rev. D

02/25/03

Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time

without notice.

ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to

obtain the latest version of this device specification before relying on any published information and before placing orders for products.

300-mil Plastic SOJ

Package Code: J

Notes:

1. Controlling dimension: inches, unless otherwise

specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E1 do not include mold flash

protrusions and

shouldbemeasuredfromthebottomof

4. Formed leads shall be planar with respect to one

another within 0.004 inches at the seating plane.

MILLIMETERS

INCHES

Sym.

Min. Typ. Max.

Min. Typ. Max.

N0.

Leads

24/26

A

—

—

3.56

—

—

0.140

A1

0.64

—

—

0.025

—

—

A2

2.41

—

2.67

0.095

—

0.105

b

0.41

—

0.51

0.016

—

0.020

B

0.66

—

0.81

0.026

—

0.032

C

0.20

—

0.25

0.008

—

0.010

D

17.02

—

17.27

0.670

—

0.680

E

8.26

—

8.76

0.325

—

0.345

E1

7.49

—

7.75

0.295

—

0.305

E2

6.27

—

7.29

0.247

—

0.287

e

1.27 BSC

0.050 BSC

SEATING PLANE

1

N

E1

D

E2

E

b

e

A1

A

B

C

A2